Integrated circuit packaging system with posts and method of manufacture thereof

Abstract

A method of manufacture of an integrated circuit packaging system includes: providing a semiconductor wafer having a chip pad; attaching a wafer frame to the semiconductor wafer, the wafer frame having a horizontal cover integral to a protruding connector with the protruding connector on the chip pad; forming an underfill around the protruding connector and between the horizontal cover and the semiconductor wafer; removing the horizontal cover exposing the underfill and the protruding connector; and singulating an integrated circuit package from the semiconductor wafer.

1 . A method of manufacture of an integrated circuit packaging system comprising:
 providing a semiconductor wafer having a chip pad;   attaching a wafer frame to the semiconductor wafer, the wafer frame having a horizontal cover integral to a protruding connector with the protruding connector on the chip pad;   forming an underfill around the protruding connector and between the horizontal cover and the semiconductor wafer;   removing the horizontal cover exposing the underfill and the protruding connector; and   singulating an integrated circuit package from the semiconductor wafer.   
     
     
         2 . The method as claimed in  claim 1  wherein removing the horizontal cover includes planarizing the horizontal cover to expose the protruding connector having planarization marks. 
     
     
         3 . The method as claimed in  claim 1  wherein removing the horizontal cover includes etching the horizontal cover to expose the protruding connector having etch marks. 
     
     
         4 . The method as claimed in  claim 1  wherein attaching the wafer frame having the horizontal cover integral to the protruding connector includes attaching the wafer frame having a protect layer between the horizontal cover and the protruding connector. 
     
     
         5 . The method as claimed in  claim 1  wherein:
 attaching the wafer frame having the horizontal cover integral to the protruding connector includes attaching the wafer frame having a protect layer between the horizontal cover and the protruding connector; and 
 removing the horizontal cover includes exposing the protect layer. 
 
     
     
         6 . A method of manufacture of an integrated circuit packaging system comprising:
 providing a semiconductor wafer having a chip pad;   attaching a wafer frame to the semiconductor wafer, the wafer frame having a horizontal cover integral to a protruding connector with the protruding connector on the chip pad;   applying an underfill around the protruding connector, around the chip pad, and between the horizontal cover and the semiconductor wafer;   removing the horizontal cover exposing the underfill and the protruding connector; and   singulating an integrated circuit package from the semiconductor wafer.   
     
     
         7 . The method as claimed in  claim 6  wherein:
 attaching the wafer frame having the horizontal cover integral to the protruding connector includes attaching the wafer frame having a protect layer between the horizontal cover and the protruding connector, the protect layer partially within the horizontal cover; and 
 removing the horizontal cover exposing the protruding connector. 
 
     
     
         8 . The method as claimed in  claim 6  wherein removing the horizontal cover includes planarizing the horizontal cover to expose the underfill having planarization marks. 
     
     
         9 . The method as claimed in  claim 6  wherein removing the horizontal cover exposing the underfill includes planarizing the horizontal cover to expose the underfill and the protruding connector having planarization marks. 
     
     
         10 . The method as claimed in  claim 6  wherein removing the horizontal cover includes removing the horizontal cover exposing the underfill coplanar with the protruding connector. 
     
     
         11 . An integrated circuit packaging system comprising:
 an integrated circuit chip having a chip pad;   a conductive post on the chip pad; and   an underfill around the conductive post, the conductive post exposed from the underfill, and a non-horizontal underfill side of the underfill planar with a non-horizontal side of the integrated circuit chip.   
     
     
         12 . The system as claimed in  claim 11  wherein the conductive post includes the conductive post having a post end with planarization marks exposed from the underfill. 
     
     
         13 . The system as claimed in  claim 11  wherein the conductive post includes the conductive post having a post end with etch marks exposed from the underfill. 
     
     
         14 . The system as claimed in  claim 11  wherein:
 the conductive post includes a post end; and 
 the underfill includes an attachment side planar with the post end, the post end and the attachment side exposed having planarization marks. 
 
     
     
         15 . The system as claimed in  claim 11  wherein the underfill around the conductive post includes the conductive post having a protect layer exposed from the underfill. 
     
     
         16 . The system as claimed in  claim 11  wherein the underfill includes the underfill around the chip pad. 
     
     
         17 . The system as claimed in  claim 16  wherein:
 the underfill includes an attachment side; and 
 
       further comprising:
 a protect layer on the conductive post exposed above the attachment side. 
 
     
     
         18 . The system as claimed in  claim 16  wherein:
 the underfill includes an attachment side; and 
 the conductive post includes a post end exposed below the attachment side. 
 
     
     
         19 . The system as claimed in  claim 16  wherein:
 the underfill includes an attachment side; 
 the conductive post includes a post end of the conductive post exposed from the attachment side; and 
 
       further comprising:
 a substrate attached to the post end. 
 
     
     
         20 . The system as claimed in  claim 16  wherein the underfill includes an attachment side of the underfill having etch marks.