Chalcogenide-based materials and methods of making such materials under vacuum using post-chalcogenization techniques
Abstract
The present invention provides strategies for making high quality CIGS photoabsorbing compositions from sputtered precursor film(s). The precursors are converted into CIGS photoabsorbing material via a chalcogenizing treatment (also referred to as “post-chalcogenization,” including, e.g., “post-selenization” when Se is used and/or “post-sulfurization” when S is used) using techniques that allow the post-chalcogenizing treatment to occur under atypically low pressure conditions. Consequently, the strategies of the invention are readily incorporated into batch processes or continuous processes such as roll-to-roll process occurring under vacuum. The present invention is useful at lab, pilot plant, and industrial scales.
Claims
exact text as granted — not AI-modified1 . A method of making a chalcogen-containing photoabsorbing composition, comprising the steps of:
a) forming a workpiece comprising a precursor of the chalcogen-containing photoabsorber; b) forming a cap on the precursor, said cap comprising at least one chalcogen; c) heating the capped workpiece to cause chalcogenization at a pressure of below about 300 millitorr.
2 . The method of claim 1 , wherein the process occurs in a roll-to-roll manufacturing process.
3 . The method of claim 1 , wherein the heating occurs in the presence of an inert gas.
4 . The method of claim 1 , wherein the cap incorporates at least one chalcogen in elemental form.
5 . The method of claim 4 , wherein the cap comprises elemental Se.
6 . The method of claim 1 , wherein at least the heating step occurs in the presence of at least one gas comprising a chalcogen.
7 . The method of claim 6 , wherein at least the annealing step occurs in the presence of a gas comprising H 2 S or H 2 Se.
8 . The method of claim 1 , wherein the chalcogenization treatment converts at least a portion of the precursor to a chalcogenide photoabsorbing material.
9 . The method of claim 1 , wherein the heating temperature is in the range from about 300° C. to about 600° C.
10 . The method of claim 1 , wherein at least the heating step occurs at a pressure of less than about 100 millitorr.
11 . The method of claim 1 , wherein at least the heating step occurs at a pressure less than about 50 millitorr.
12 . The method of claim 1 , wherein the precursor film comprises Cu, In, and Ga.
13 . The method of claim 12 , wherein the step of forming the workpiece comprises using a sputtering target comprising Cu, In and Ga to form the precursor.
14 . The method of claim 12 , wherein the step of forming the workpiece comprises using at least one confocal target to form the precursor.
15 . The method of claim 1 , wherein the precursor comprises a sub-stoichiometric amount of at least one chalcogen.
16 . The method of claim 1 , wherein the heating occurs at a rate in the range from about 5° C./minute to about 400° C./minute.
17 . The method of claim 16 , wherein the heating occurs at a rate having a substantially linear profile.
18 . The method of claim 1 , wherein the workpiece is maintained at one or more temperatures below about 100° C. prior to the heating step.
19 . The method of claim 1 , wherein the step of forming the workpiece comprises (a) cleaning a metallic support under conditions effective to remove organic impurities and (b) forming the workpiece on a substrate incorporating the cleaned metallic support.Join the waitlist — get patent alerts
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