US2011283532A1PendingUtilityA1
Flexible wiring board and method of manufacturing same
Est. expiryMar 10, 2028(~1.6 yrs left)· nominal 20-yr term from priority
Inventors:Michimasa Takahashi
H05K 3/46H05K 1/02H05K 2201/09509H05K 1/0218H05K 2201/0715Y10T29/49155H05K 3/4602H05K 2201/09127H05K 2201/09563Y10T29/49124H05K 3/4652H05K 2201/0187H05K 3/4691
54
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Claims
Abstract
A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer.
Claims
exact text as granted — not AI-modified1 . A method of manufacturing a flexible wiring board, comprising: disposing a first flexible base material having a conductor pattern thereon and a second flexible base material adjacent to each other; covering a boundary between the first flexible base material and the second flexible base material with an insulating layer; providing a conductor pattern on the insulating layer; forming a via hole that penetrates the insulating layer and reaches the conductor pattern in the second flexible base material; and plating the via hole opening to form a via connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer.
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