Method for double-dip substrate spin optimization of coated micro array supports

Abstract

Described is a method for preparing a substrate-coated support for use in micro-array devices. The method comprises the steps of applying a first coat of substrate to a support, making the substrate coating ramp by subjecting the coated support to centripetal forces, adding a second coat of substrate to the resulting support having a ramping planar coat, and subjecting the coated support to centripetal forces for a second time to produce a substrate-coated membrane in which the thickness of the substrate layer is uniform across the entire coated surface.

1 .- 20 . (canceled) 
     
     
         21 . A method for preparing a substrate-coated support, the method comprising the steps of:
 (a) coating at least one surface of a support having a first edge and a second edge with a substrate coating by dipping the support in a liquid or semi-solid substrate coating;   (b) positioning the thus coated support into a dust free chamber having an inner diameter and an outer diameter such that the first edge of the support is in proximity to the inner diameter of the dust free chamber and the outer edge of the support is in proximity to the outer diameter of the dust free chamber;   (c) centrifuging the dust free chamber at a relative centrifugal force and for a length of time until the substrate coating on the substrate-coated support is thinner at the first edge than at the second edge, wherein the inner diameter is closer to an axis of rotation about the dust free chamber than the outer diameter;   (d) removing the substrate-coated support from the dust free chamber; and   (e) applying a second coat of substrate coating to the substrate-coated support according to steps (b) to (d) so as to provide a double-substrate-coated support having a planar film with uniform thickness across the substrate-coated surface.