US2011272854A1PendingUtilityA1

Semiaromatic polyamide composite article and processes for its preparation

Assignee: DU PONTPriority: Jun 16, 2006Filed: Jul 21, 2011Published: Nov 10, 2011
Est. expiryJun 16, 2026(expired)· nominal 20-yr term from priority
C08L 77/00B29K 2105/12B32B 27/34B29C 45/14786C08L 2205/02Y10T428/269Y10T428/24994Y10T428/253Y10T428/31855Y10T428/31786Y10T428/25Y10T428/31725
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Claims

Abstract

A semiaromatic polyamide composite article comprising a first component comprising a fiber-reinforced material comprising a polyamide composition and reinforcing fibers and having a tensile modulus of at least about 16 GPa as measured by ISO method 527-2:1993 at a rate of 5 mm/min on test specimens having a thickness of 4 mm, a second component comprising a polyamide composition, and an optional tie layer therebetween. The polyamide composition of first component and/or the second component is a semiaromatic polyamide compositions. The second component is prepared by injection molding and/or injection-compression molding the semiaromatic polyamide composition onto the first component.

Claims

exact text as granted — not AI-modified
1 . A process for the preparation of a semiaromatic polyamide composite article, comprising the steps of:
 (a) preparing by a non-injection molding process a first component having a surface and comprising a fiber-reinforced material comprising a polyamide composition and reinforcing fibers, wherein the fiber-reinforced material has a tensile modulus of at least about 16 GPa as measured by ISO method 527-2:1993 at a rate of 5 mm/min on test specimens having a thickness of 4 mm;   (b) injection molding and/or injection-compression molding a polyamide composition onto the surface of the first component to form a second component;   
       wherein the polyamide composition of the first component and/or the polyamide composition of the second component Is a semiaromatic polyamide composition, 
       said method further comprising comprising injection molding and/or injection-compression molding the composition of the second component onto the surface of the first component when the optional tie layer is not present and injection molding and/or injection-compression molding the composition of the second component onto the second surface of the optional tie layer when the tie layer is present, and wherein the semiaromatic polyamide composite article has at least a 58% retention of storage modulus at 125° C. relative to the storage modulus at 25° C. 
     
     
         2 . The process of  claim 1 , wherein the fiber-reinforced material is a laminate. 
     
     
         3 . The process of  claim 1 , wherein the first component is prepared from the fiber-reinforced material by one or more of die cutting, stamping, thermoforming, machining, and/or compression molding. 
     
     
         4 . The process of  claim 1 , wherein the reinforcing fibers are selected from one or more of glass fibers, carbon fibers, and aramid fibers. 
     
     
         5 . The process of  claim 1 , wherein the polyamide composition of the second component is a semiaromatic polyamide composition comprising one or more of poly(m-xylylene adipamide) (polyamide MXD,6); hexamethylene adipamide/hexamethylene terephthalamide copolyamide (polyamide 6,T/6,6); hexamethylene terephthalamide/2-methylpentamethylene terephthalamide copolyamide (polyamide 6,T/D,T); poly(dodecamethylene terephthalamide) (polyamide 12,T); poly(decamethylene terephthalamide) (polyamide 10,T); decamethylene terephthalamide/decamethylene dodecanoamide copolyamide (10,T/10,12); poly(nonamethylene terephthalamide) (polyamide 9,T); the polyamide of hexamethylene isophthalamide and hexamethylene adipamide (polyamide 6,I/6,6); and/or the polyamide of hexamethylene terephthalamide, hexamethylene isophthalamide, and hexamethylene adipamide (polyamide 6,T/6,I/6,6). 
     
     
         6 . The process of  claim 1 , said method the steps of adhering to or positioning in contact with the surface of the first component a first surface of a tie layer before performing step (b). 
     
     
         7 . The process of  claim 1 , the composition of said tie layer is an semiaromatic polyamide composition comprising one or more of poly(m-xylylene adipamide) (polyamide MXD,6); hexamethylene adipamide/hexamethylene terephthalamide copolyamide (polyamide 6,T/6,6); hexamethylene terephthalamide/2-methylpentamethylene terephthalamide copolyamide (polyamide 6,T/D,T); poly(dodecamethylene terephthalamide) (polyamide 12,T); poly(decamethylene terephthalamide) (polyamide 10,T); decamethylene terephthalamide/decamethylene dodecanoamide copolyamide (10,T/10,12); poly(nonamethylene terephthalamide) (polyamide 9,T); the polyamide of hexamethylene isophthalamide and hexamethylene adipamide (polyamide 6,I/6,6); and/or the polyamide of hexamethylene terephthalamide, hexamethylene isophthalamide, and hexamethylene adipamide (polyamide 6,T/6,I/6,6) 
     
     
         8 . The process of  claim 7 , wherein the tie layer comprises one or more polyamides, ionomers, and/or polyurethanes. 
     
     
         9 . The process of  claim 7 , wherein the tie layer comprises one or more of polyamide 6; polyamide 6,6; polyamide 6,10; polyamide 6,12; polyamide 12; polyamide 11; and amorphous polyamides. 
     
     
         10 . The process of  claim 1  or  7 , wherein the polyamide composition of step (a) comprises at least one semiaromatic polyamide.

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