Compact modular liquid cooling systems for electronics

Abstract

A cooling system for a microchip or other component is described, including, in one embodiment: (1) a cold plate assembly positioned adjacent (e.g., in contact with) the component to be cooled; (2) at least one heat exchanger; (3) a fan for directing gas adjacent (e.g., through) a portion of the heat exchanger; and (4) a pump for circulating cooling fluid through a closed circuit including the cold plate and heat exchanger. The cold plate may include guide fins that define macrochannels and microchannels that serve as conduits for the cooling fluid. The fins and channels in one embodiment are shaped to substantially match the heat map profile of the chip or component to be cooled. The heat exchanger in one embodiment includes a reservoir in its base which may cooperate with a recess or channel in a support plate to form an additional cooling fluid flow passage.

1 . A cooling system for electronic components comprising:
 a cold plate assembly defining at least one cold plate fluid flow passage, said cold plate defining an upper and a lower surface;   at least one heat exchanger disposed adjacent said upper surface of said cold plate assembly, each of said at least one heat exchangers comprising at least one heat exchanger fluid flow passage;   a fan that is positioned for causing gas to flow adjacent said heat exchanger;   one or more liquid conduits for facilitating the flow of a cooling fluid through an at least substantially closed circuit that extends through said cold plate fluid flow passage and said at least one heat exchanger fluid flow passage; and   a pump that is positioned and configured to cause said cooling fluid to flow through said substantially closed circuit, wherein:
 said cold plate assembly comprises: (A) a cold plate; and (B) a support plate disposed immediately adjacent said upper surface of said cold plate, wherein a perimeter of said support plate is longer than a perimeter of said cold plate; and 
 said cooling system is adapted to be positioned adjacent an electronic component and to cool said electronic component. 
   
     
     
         2 . The cooling system of  claim 1 , wherein said pump is positioned adjacent said upper surface of said cold plate assembly. 
     
     
         3 . The cooling system of  claim 1 , wherein said heat exchanger is at least substantially semi-annular. 
     
     
         4 . The cooling system of  claim 1 , wherein:
 said cold plate comprises a plurality of fins that define a plurality of microchannels; and   said cooling system is adapted so that, as cooling fluid flows through said closed liquid circuit, at least a portion of said cooling fluid flows through said plurality of microchannels.   
     
     
         5 . The cooling system of  claim 1 , wherein:
 said cold plate comprises a plurality of interrupted fins; and   said cooling system is adapted so that, as said cooling fluid flows through said closed liquid circuit, at least a portion of said cooling fluid flows through one or more passages defined by said plurality of interrupted fins.   
     
     
         6 . The cooling system of  claim 5 , wherein:
 said plurality of interrupted fins comprises a plurality of pin fins.   
     
     
         7 . The cooling system of  claim 1 , wherein:
 said heat exchanger is mounted adjacent said support plate;   a lower portion said heat exchanger and a particular portion of said upper surface of said support plate cooperate to form a fluid reservoir; and   said cooling system is adapted so that, as cooling fluid flows through said closed liquid circuit:
 at least a portion of said cooling fluid flows through said fluid reservoir; and 
 as a volume of said cooling fluid flows through said fluid reservoir, said volume of said cooling fluid engages both an interior surface of said lower portion of said heat exchanger and said particular portion of said upper surface of said support plate. 
   
     
     
         8 . The cooling system of  claim 1 , wherein said fluid reservoir is at least substantially semi-annular. 
     
     
         9 . A cooling system for electronic components comprising:
 a cold plate assembly defining at least one cold plate fluid flow passage, said cold plate assembly defining an upper and a lower surface;   at least one heat exchanger defining at least one heat exchanger fluid flow passage;   a fan positioned to cause gas to flow adjacent said heat exchanger;   one or more liquid conduits for facilitating the flow of a cooling fluid through an at least substantially closed circuit that extends through said cold plate fluid flow passage and said at least one heat exchanger fluid flow passage; and   a pump that is positioned and configured to cause said cooling fluid to flow through said at least substantially closed circuit, wherein:   said cooling system is adapted to be positioned so that said cold plate assembly engages an electronic component to thereby cool said electronic component;   a lower portion of said heat exchanger and a particular portion of said upper surface of said cold plate assembly cooperate to form a fluid reservoir; and
 said cooling system is adapted so that, as cooling fluid flows through said at least substantially closed liquid circuit:
 at least a portion of said cooling fluid flows through said fluid reservoir; and 
 as a volume of said cooling fluid flows through said fluid reservoir, said volume of said cooling fluid engages both an interior surface of said lower portion of said heat exchanger and said particular portion of said upper surface of said cold plate assembly. 
 
   
     
     
         10 . The cooling system of  claim 9 , wherein said fluid reservoir is at least semi-annular. 
     
     
         11 . The cooling system of  claim 9 , wherein said lower portion of said heat exchanger defines an elongated opening that is disposed immediately adjacent said upper surface of said cold plate assembly. 
     
     
         12 . The cooling system of  claim 11 , wherein:
 said cold plate assembly defines an elongated recess adjacent said elongated opening that comprises at least part of said fluid reservoir;   said cold plate assembly comprises a plurality of fins disposed within said elongated recess; and   said cooling system is adapted so that, as cooling fluid flows through said closed liquid circuit:
 at least a portion of said cooling fluid flows through said fluid reservoir; and 
 as a volume of said cooling fluid flows through said fluid reservoir, said volume of said cooling fluid flows through a plurality of channels defined by said fins. 
   
     
     
         13 . The cooling system of  claim 12 , wherein said plurality of fins comprises a plurality of pin fins. 
     
     
         14 . The cooling system of said  claim 9 , wherein said elongated opening is substantially annular. 
     
     
         15 . The cooling system of  claim 9 , wherein said cold plate assembly comprises an electronic component engagement portion that is adapted for engaging said electronic component while said cooling system is being used to cool said electronic component; and
 said electronic component engagement portion is disposed adjacent a central portion of a bottom surface of said cold plate assembly.   
     
     
         16 . The cooling system of  claim 15 , wherein said electronic component engagement portion is positioned beneath said fan. 
     
     
         17 . A method of cooling an electronic component comprising:
 (A) providing a cold plate assembly that defines at least one cold plate fluid flow passage and that includes a plurality of fins that are disposed within said fluid flow passage;   (B) providing at least one heat exchanger that defines at least one heat exchanger fluid flow passage;   (C) providing a fan that is positioned to cause gas to flow adjacent said at least one heat exchanger;   (D) providing a pump that is adapted for circulating a cooling fluid through: (1) said at least one heat exchanger fluid flow passage; and (2) said at least one cold plate fluid flow passage;   (E) using said pump to repeatedly recirculate said cooling fluid through: (1) said at least one heat exchanger fluid flow passage, and (2) said at least one cold plate fluid flow passage;   (F) while executing said Step (E), using said fan to cause gas to flow adjacent said at least one heat exchanger; and   (G) using said cold plate assembly to cool said electronic component.   
     
     
         18 . The method of  claim 17 , wherein said step of using said cold plate assembly to cool said electronic component comprises maintaining said electronic component in physical contact with at least a portion of said cold plate. 
     
     
         19 . The method of  claim 17 , wherein said step of using said pump to repeatedly recirculate said cooling fluid through: (A) said at least one heat exchanger fluid flow passage, and (B) said at least one cold plate fluid flow passage comprises using said pump to repeatedly recirculate said cooling fluid first through one or more channels defined by said plurality of fins. 
     
     
         20 . The method of  claim 19 , wherein said one or more channels are microchannels. 
     
     
         21 . The method of  claim 17 , wherein said plurality of fins are substantially uniformly spaced apart from each other within said cold plate fluid flow passage. 
     
     
         22 . The method of  claim 21 , wherein said plurality of fins comprises at least five fins. 
     
     
         23 . The method of  claim 17 , wherein said step of using said pump to repeatedly recirculate said cooling fluid first through said at least one heat exchanger fluid flow passage and then through said at least one cold plate fluid flow passage comprises using said pump to repeatedly recirculate said cooling fluid over an upper surface of said cold plate assembly. 
     
     
         24 . The method of  claim 23 , wherein said step of using said pump to repeatedly recirculate said cooling fluid over a portion of said upper surface of said cold plate assembly comprises using said pump to repeatedly recirculate said cooling fluid over said upper surface in at least a substantially semi-annular path.