System and Method for Making Lab Card by Embossing

Abstract

In one aspect of the invention, systems, methods, and devices are provided for creating microfluidic and nanofluidic structures. In some embodiments, such systems, methods, and devices are used to create features with high aspect ratios in lab cards.

1 .- 31 . (canceled) 
     
     
         32 . A method of constructing one or more channels within a substrate, the method comprising:
 inserting a substrate into a mold, wherein the mold comprises a top plate, a middle plate, and a back plate, wherein the back plate comprises one or more channel pins and one or more alignment pins; and   constructing one or more channels within the substrate, wherein the substrate is heated such that the one or more channel pins penetrate the substrate to construct the one or more channels.   
     
     
         33 . The method of  claim 32 , wherein constructing the one or more channels comprises using a delay mechanism, and wherein use of the delay mechanism prevents substrate penetration by the one or more channel pins. 
     
     
         34 . The method of  claim 33 , wherein the delay mechanism is active for a specified length of time after heating of the substrate begins. 
     
     
         35 . The method of  claim 33 , wherein the delay mechanism comprises a pressure sensitive mechanism. 
     
     
         36 . The method of  claim 33 , wherein the delay mechanism comprises a thermally sensitive component, and wherein heating the substrate additionally heats the thermally sensitive component. 
     
     
         37 . The method of  claim 36 , wherein the thermally sensitive component is a plurality of spacers, wherein the plurality of spacers is located between the middle plate and the back plate when heating of the substrate begins, wherein the plurality of spacers are designed to soften when heated to approximately a spacer glass transition temperature, and wherein heating the plurality of spacers to approximately the spacer glass transition temperature removes the plurality of spacers from between the middle plate and the back plate. 
     
     
         38 . The method of  claim 37 , wherein the spacer glass transition temperature is approximately equal to a substrate glass transition temperature. 
     
     
         39 . The method of  claim 32 , wherein the substrate possesses a substrate glass transition temperature, and wherein the substrate is heated to approximately the substrate glass transition temperature. 
     
     
         40 . The method of  claim 32 , wherein the one or more channels possess an aspect ratio of channel depth to channel diameter of at least 20. 
     
     
         41 . The method of  claim 40 , wherein the aspect ratio is at least 50. 
     
     
         42 . The method of  claim 41 , wherein the aspect ratio is at least 100. 
     
     
         43 . The method of  claim 32 , wherein the one or more channels possess a channel depth from about 10 μm to about 5000 μm and a channel diameter from about 10 μm to about 5000 μm. 
     
     
         44 . The method of  claim 43 , wherein the channel depth is about 50 μm to about 1000 μm and the channel diameter is about 100 μm to about 1000 μm. 
     
     
         45 . The method of  claim 44 , wherein the channel depth is about 100 μm to about 1000 μm and the channel diameter is about 100 μm to about 500 μm. 
     
     
         46 . The method of  claim 32 , wherein the middle plate comprises one or more imprinting features, and wherein constructing the one or more channels additionally imprints one or more features onto the substrate. 
     
     
         47 . The method of  claim 32 , wherein the back plate comprises one or more nano structure pins, and wherein constructing the one or more channels additionally imprints one or more nano structures onto the substrate. 
     
     
         48 . The method of  claim 32 , wherein the mold is coated, at least in part, with a releasing agent. 
     
     
         49 . The method of  claim 32 , wherein constructing the one or more channels additionally comprises moving the back plate toward the top plate. 
     
     
         50 . A method of constructing one or more channels within a substrate, the method comprising:
 inserting a substrate into a mold, wherein the mold comprises a top plate, a middle plate, and a back plate, wherein the back plate comprises one or more channel pins, one or more alignment pins and one or more nano structure pins;   constructing one or more channels within the substrate, wherein the substrate is heated such that the one or more channel pins penetrate the substrate to construct the one or more channels; and   imprinting one or more nano structures onto the substrate, wherein the substrate is heated such that the one or more nano structure pins imprint the one or more nano structures.   
     
     
         51 . A method of constructing one or more channels within a substrate, the method comprising:
 inserting a substrate into a mold, wherein the mold comprises a top plate, a middle plate, and a back plate, wherein the back plate comprises one or more channel pins and one or more alignment pins; and   constructing one or more channels within the substrate, wherein the substrate is heated such that the one or more channel pins penetrate the substrate to construct the one or more channels, wherein penetration of the substrate is delayed by a plurality of thermally sensitive spacers located between the middle plate and the back plate and possessing a spacer glass transition temperature, and wherein heating the substrate also heats the plurality of thermally sensitive spacers to approximately the spacer glass transition temperature.