US2011267903A1PendingUtilityA1

Semiconductor memory device having dram cell mode and non-volatile memory cell mode and operation method thereof

Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Aug 23, 2006Filed: Jul 14, 2011Published: Nov 3, 2011
Est. expiryAug 23, 2026(~0.1 yrs left)· nominal 20-yr term from priority
H10D 30/69H10D 30/711H10D 30/681H10B 12/00H10B 69/00G11C 5/02G11C 11/404G11C 7/1045H10B 12/20
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Claims

Abstract

A semiconductor memory device may have a DRAM cell mode and a non-volatile memory cell mode without a capacitor, including multiple transistors arranged in an array and having floating bodies, word lines connected to gate electrodes of the transistors, bit lines at a first side of the gate electrodes connected to drains of the transistors, source lines at a second side of the gate electrodes, different from the first side, and connected to sources of the transistors on the semiconductor substrate, and charge storage regions between the gate electrodes and the floating bodies.

Claims

exact text as granted — not AI-modified
1 .- 19 . (canceled) 
     
     
         20 . A method of operating a semiconductor memory device having memory cells arranged in an array, each of the memory cells including a semiconductor substrate, a floating body disposed on the semiconductor substrate, a gate electrode insulated from the floating body, a source and a drain disposed in the semiconductor substrate at both sides of the gate electrode, and a charge storage region interposed between the floating body and the gate electrode, the method comprising:
 selecting at least one cell of memory cells;   determining whether the selected sell is to operate in a DRAM cell mode or a non-volatile memory cell mode; and   operating the selected cell in the DRAM cell mode or the non-volatile memory cell mode, after determining an operational mode.

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