Heat dissipation device with heat pipe

Abstract

An exemplary heat dissipation device for a heat-generating component includes a heat sink, a heat pipe and a heat conductive member. The heat sink includes a plurality of stacked first fins and second fins. Each of the first fins defines an accommodating groove therein. The heat pipe includes an evaporator section, a condenser section and a connecting section interconnecting the evaporator section and the condenser section. The evaporator section thermally connects the heat-generating component. The connecting section extends obliquely from the evaporator section to the first fins. The condenser section is attached to the second fins. The connecting section is accommodated in the accommodating grooves of the first fins, and makes no thermal contact with the first fins. The heat conductive member thermally connects the first fins with the heat-generating component.

1 . A heat dissipation device for a heat-generating component, the heat dissipation device comprising:
 a heat sink comprising a plurality of stacked first fins and second fins, each of the first fins defining an accommodating groove therein;   a heat pipe attached to the heat sink, the heat pipe comprising an evaporator section, a condenser section and a connecting section interconnecting the evaporator section and the condenser section, the evaporator section configured for thermally connecting with the heat-generating component, the connecting section extending obliquely from the evaporator section to the first fins, the condenser section attached to the second fins, the connecting section accommodated in the accommodating grooves of the first fins and not contacting the first fins; and   a heat conductive member connecting with the first fins, and configured for thermally connecting with the heat-generating component.   
     
     
         2 . The heat dissipation device of  claim 1 , wherein each first fin defines a joining hole therein, the heat conductive member comprises a heat conductive base and a heat transfer post on the heat conductive base, the heat conductive base is configured for thermally connecting with the heat-generating component, and the heat transfer post is received in the joining holes of the first fins. 
     
     
         3 . The heat dissipation device of  claim 2 , further comprising a top plate, the top plate defining an opening therethrough, the heat conductive base extending through the opening. 
     
     
         4 . The heat dissipation device of  claim 3 , wherein the top plate and the heat conductive base both define a receiving groove therein, and the receiving grooves receives the evaporator section of the heat pipe. 
     
     
         5 . The heat dissipation device of  claim 3 , wherein the opening comprises an orienting hole and a pair of fixing grooves in communication with the orienting hole, the orienting hole spans through an entire thickness of the top plate, the fixing grooves are disposed at opposite ends of the orienting hole, respectively, the heat conductive base comprises a main body and a pair of tabs extending out from opposite ends of the main body, respectively, the main body extends through the orienting hole of the opening, and the tabs are oriented in the fixing grooves of the opening, respectively. 
     
     
         6 . The heat dissipation device of  claim 2 , wherein each of the second fins defines a joining hole therein, and the heat transfer post further extends to the second fins and is received in the joining holes of the second fins. 
     
     
         7 . The heat dissipation device of  claim 1 , wherein the connecting section of the heat pipe extends laterally and obliquely from the evaporator section, or longitudinally and obliquely from the evaporator section. 
     
     
         8 . The heat dissipation device of  claim 1 , wherein a width of the accommodating groove is greater than a distance spanned by the connecting section when projected onto the first fins. 
     
     
         9 . The heat dissipation device of  claim 1 , wherein the connecting section of the heat pipe is one of arcuate and straight. 
     
     
         10 . The heat dissipation device of  claim 1 , further comprising an electrically conductive post extending through at least one of the plurality of first fins and the combined plurality of first and second fins. 
     
     
         11 . The heat dissipation device of  claim 1 , wherein each of the second fins defines a connecting hole aligning with the accommodating grooves of the first fins, and the condenser section of the heat pipe is received in the connecting holes of the second fins. 
     
     
         12 . The heat dissipation device of  claim 1 , further comprising a fan positioned for directing airflow to the heat sink, one of the plurality of first fins and the combined plurality of first and second fins defining a receiving space receiving the fan therein, the receiving space communicating with the accommodating grooves of the first fins. 
     
     
         13 . A heat dissipation device for a heat-generating component, the heat dissipation device comprising:
 a heat sink defining an accommodating space therein;   a heat pipe comprising an evaporator section, a condenser section and a connecting section interconnecting the evaporator section and the condenser section, the evaporator section configured for thermally connecting with the heat-generating component, the connecting section extending obliquely from the evaporator section to the heat sink, the condenser section attached to the heat sink, the connecting section accommodated in the accommodating space of the heat sink and not contacting the heat sink; and   a heat conductive member connecting with the first fins, and configured for thermally connecting with the heat-generating component.   
     
     
         14 . The heat dissipation device of  claim 13 , wherein the heat sink defines a joining hole therein, the heat conductive member comprises a heat conductive base and a heat transfer post on the heat conductive base, the heat conductive base is configured for thermally connecting with the heat-generating component, and the heat transfer post is received in the joining hole of the heat sink. 
     
     
         15 . The heat dissipation device of  claim 14 , further comprising a top plate, the top plate defining an opening therethrough, the opening comprising an orienting hole and a pair of fixing grooves in communication with the orienting hole, the orienting hole extending through the top plate, the fixing grooves disposed at opposite ends of the orienting hole, respectively, the heat conductive base comprising a main body and a pair of tabs extending out from opposite ends of the main body, respectively, the main body extending through the orienting hole of the opening, the tabs oriented in the fixing grooves of the opening, respectively. 
     
     
         16 . The heat dissipation device of  claim 13 , wherein the connecting section of the heat pipe extends laterally and obliquely from the evaporator section, or longitudinally and obliquely from the evaporator section. 
     
     
         17 . The heat dissipation device of  claim 13 , wherein a width of the accommodating space is greater than a distance spanned by the connecting section when projected onto the heat sink. 
     
     
         18 . A heat dissipation device for a heat-generating component, the heat dissipation device comprising:
 a heat sink comprising a plurality of stacked first fins and second fins, internal portions of the first fins cooperatively defining an accommodating space of the first fins;   a heat pipe attached to the heat sink, the heat pipe comprising an evaporator section, a condenser section and a connecting section interconnecting the evaporator section and the condenser section, the evaporator section configured for thermally connecting with the heat-generating component, the connecting section extending obliquely from the evaporator section to the first fins, the condenser section attached to the second fins, and the connecting section accommodated in the accommodating space of the first fins without contacting any of the first fins; and   a heat conductive member connecting with the first fins, and configured for thermally connecting with the heat-generating component.   
     
     
         19 . The heat dissipation device of  claim 18 , wherein each first fin defines a joining hole therein, the heat conductive member comprises a heat conductive base and a heat transfer post on the heat conductive base, the heat conductive base is configured for thermally connecting the heat-generating component, and the heat transfer post is received in the joining holes of the first fins. 
     
     
         20 . The heat dissipation device of  claim 18 , wherein the connecting section of the heat pipe extends laterally and obliquely from the evaporator section, or longitudinally and obliquely from the evaporator section.