Mounting base

Abstract

The disclosure relates to a mounting base for an electric component, including, for example, first surface for receiving the electric component, and for receiving a heat load generated by the electric component, and a second surface for dissipating heat from the mounting base. The mounting base can include evaporator channels arranged in the vicinity of the first surface, condenser channels in the vicinity of the second surface and a first and second connecting part for passing fluid between the condenser channels and evaporator channels.

1 . A mounting base for an electric component, comprising:
 a first surface for receiving the electric component and for receiving a heat load generated by the electric component;   a second surface for dissipating heat from the mounting base;   evaporator channels arranged in a vicinity of the first surface for transferring received heat load to a fluid in the evaporator channels;   condenser channels in a vicinity of the second surface for transferring heat from fluid in the condenser channels to the second surface;   a first connecting part for passing fluid from the condenser channels to the evaporator channels; and   a second connecting part for passing fluid from the evaporator channels to the condenser channels.   
     
     
         2 . A mounting base according to  claim 1 , wherein the second surface comprises:
 at least one of a heat sink and a fin structure for dissipating heat into air.   
     
     
         3 . A mounting base according to  claim 1 , wherein the evaporator channels and the condenser channels are grouped together into at least a first group and a second group, each group including at least one evaporator channel and at least one condenser channel. 
     
     
         4 . A mounting base according to  claim 3 , wherein
 the first connecting part is arranged for conducting fluid from one or more condenser channels of the first group into one or more evaporator channels of the at least first and second groups; and   the second connecting part is arranged for conducting fluid from one or more evaporator channels of the first group into one or more condenser channels of the at least first and second groups.   
     
     
         5 . A mounting base according to  claim 1 , wherein the mounting base formed with an aluminum alloy or a copper alloy.