Interposer and method for manufacturing interposer

Abstract

A method of manufacturing an interposer including forming an inorganic insulating layer over a support substrate, forming a first wiring in or on a surface of the inorganic insulating layer, forming an organic insulating layer over the inorganic insulating layer and the first wiring, forming a second wiring on the organic insulating layer, and forming a conductor portion connecting the second wiring and the first wiring.

1 . A method of manufacturing an interposer comprising:
 forming an inorganic insulating layer over a support substrate;   forming a first wiring in or on a surface of the inorganic insulating layer;   forming an organic insulating layer over the inorganic insulating layer and the first wiring;   forming a second wiring on the organic insulating layer; and   forming a conductor portion connecting the second wiring and the first wiring.   
     
     
         2 . A method of manufacturing an interposer as set forth in  claim 1 , wherein the forming of the first wiring comprises forming the first wiring by a damascene method. 
     
     
         3 . A method of manufacturing an interposer as set forth in  claim 1 , wherein the forming of the second wiring comprises forming the second wiring by a semi-additive method. 
     
     
         4 . A method of manufacturing an interposer as set forth in  claim 1 , further comprising removing the support substrate. 
     
     
         5 . A method of manufacturing an interposer as set forth in  claim 1 , wherein the forming of the second wiring and the forming of the conductor portion are performed in one process.