Heat dissipating device with an oscillation unit

Abstract

A heat dissipating device includes a heat sink and an oscillation unit. The oscillation unit is disposed in the heat sink, and includes an oscillation element, and a liquid that surrounds the oscillation element and that transmits an oscillation movement of the oscillation element to the heat sink to generate a resonant oscillation and to thereby enhance heat dissipation. By virtue of the high-frequency resonant oscillation generated in the heat sink, infrared radiation can be dissipated quickly increasing the efficiency of heat dissipation.

1 . A heat dissipating device comprising:
 a heat sink adapted to contact a heat source; and   an oscillation unit disposed in said heat sink, and including an oscillation element, and a liquid that surrounds said oscillation element and that transmits an oscillation movement of said oscillation element to said heat sink to generate a resonant oscillation and to thereby enhance heat dissipation.   
     
     
         2 . The heat dissipating device of  claim 1 , wherein said heat sink includes a heat conductive layer adapted to contact the heat source, and an infrared heat dissipating layer disposed on one side of said heat conductive layer opposite to the heat source. 
     
     
         3 . The heat dissipating device of  claim 2 , wherein said infrared heat dissipating layer is made of an infrared material. 
     
     
         4 . The heat dissipating device of  claim 3 , wherein said infrared material is selected from the group consisting of a ceramic powder, graphite, a carbon powder, silicon crystal, tungsten, titanium, and a combination thereof. 
     
     
         5 . The heat dissipating device of  claim 2 , wherein said heat conductive layer is made of metal. 
     
     
         6 . The heat dissipating device of  claim 1 , wherein said oscillating element has an oscillation frequency of no less than 1000 per second. 
     
     
         7 . The heat dissipating device of  claim 1 , wherein said heat conductive layer has top and bottom planar surfaces . 
     
     
         8 . The heat dissipating device of  claim 1 , wherein said heat sink further has a plurality of fins projecting from said infrared heat dissipating layer in a direction away from the heat source. 
     
     
         9 . The heat dissipating device of  claim 1 , wherein said heat sink has a mounting hole to receive said oscillation unit, and a closure member to close said mounting hole. 
     
     
         10 . The heat dissipating device of  claim 1 , wherein said heat sink has a mounting hole, and said oscillating unit further includes a case that contains said oscillating element and said liquid and that is fixed to said mounting hole. 
     
     
         11 . The heat dissipating device of  claim 1 , wherein said heat conductive layer is configured to be a hollow structure having a layer of hollow space to contain said oscillation unit, and said oscillation unit further includes an isolation member covering and isolating said oscillating element from said liquid.