US2011256684A1PendingUtilityA1
Field effect transistor using oxide film for channel and method of manufacturing the same
Est. expiryMar 17, 2026(expired)· nominal 20-yr term from priority
H10D 30/6757H10D 30/6713H10D 30/6715H10D 30/031H10D 62/10H10D 30/6756H10D 99/00H10D 30/6755
45
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
The present invention provides a field effect transistor including an oxide film as a semiconductor layer, wherein the oxide film includes one of a source part and a drain part to which one of hydrogen and deuterium is added.
Claims
exact text as granted — not AI-modified1 - 7 . (canceled)
8 . A method of manufacturing a field effect transistor including an oxide film as a semiconductor layer, comprising the steps of:
forming the oxide film on a substrate; and adding one of hydrogen and deuterium to a portion of the oxide film to form a source part and a drain part.
9 . A method of manufacturing a field effect transistor including an oxide film as a semiconductor layer, comprising the steps of:
forming the oxide film on a substrate; forming a gate insulating film on the oxide film; forming a gate electrode on the gate insulating film; and
adding one of hydrogen and deuterium to the oxide film with using a pattern of the gate electrode as a mask to form a source part and a drain part in the oxide film in self-alignment with the pattern of the gate electrode.
10 . (canceled)Join the waitlist — get patent alerts
Track US2011256684A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.