Wiring board and method of manufacturing wiring board

Abstract

A method of manufacturing a wiring board including forming a base substrate, forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the substrate opposing the first surface, forming an IVH (Interstitial Via Hole) that penetrates the base substrate, and cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond an edge of the second substrate.

1 . A method of manufacturing a wiring board comprising:
 forming a base substrate;   forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the substrate opposing the first surface;   forming an IVH (Interstitial Via Hole) that penetrates the base substrate; and   cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond an edge of the second substrate.   
     
     
         2 . The method of manufacturing a wiring board according to  claim 1 , further comprising:
 forming an interlayer groove portion between the first substrate and the second substrate; and   filling the interlayer groove portion with at least one of a gas, liquid or solid material.   
     
     
         3 . The method of manufacturing a wiring board according to  claim 1 , further comprising forming a warping prevention portion at a step portion created when the first substrate and the second substrate are laminated with the base substrate interposed therebetween. 
     
     
         4 . The method of manufacturing a wiring board according to  claim 1 , further comprising:
 forming an opening at a step portion created when the first substrate and the second substrate are laminated with the base substrate interposed therebetween; and   filling the opening with at least one of a gas, liquid or solid material.   
     
     
         5 . The method of manufacturing a wiring board according to  claim 1 , wherein:
 the base substrate comprises a resin-impregnated inorganic fiber, the first substrate comprises at least one of an inorganic filler composite resin or pliable resin, and   the second substrate comprises at least either inorganic filler composite resin or pliable resin.   
     
     
         6 . The method of manufacturing a wiring board according to  claim 5 , wherein the inorganic fiber comprises glass cloth. 
     
     
         7 . The method of manufacturing a wiring board according to  claim 5 , wherein at least one of the first substrate or the second substrate comprises the inorganic filler which comprises at least one of silica filler or glass filler. 
     
     
         8 . The method of manufacturing a wiring board according to  claim 1 , wherein:
 the base substrate comprises inorganic filler composite resin, and   at least one of the first substrate or the second substrate comprises resin-impregnated inorganic fiber.   
     
     
         9 . The method of manufacturing a wiring board according to  claim 8 , wherein the inorganic fiber comprises glass cloth. 
     
     
         10 . The method of manufacturing a wiring board according to  claim 8 , wherein the inorganic filler comprises at least one of silica filler or glass filler. 
     
     
         11 . The method of manufacturing a wiring board according to  claim 1 , further comprising:
 forming a conductive pattern on the first substrate;   forming a conductive pattern on the second substrate; and   connecting the conductive pattern on the first substrate and the conductive pattern on the second substrate by way of the through-hole.   
     
     
         12 . The method of manufacturing a wiring board according to  claim 1 , further comprising:
 forming stacked vias in each of the insulation layers;   forming a conductive layer on an inner surface of at least one of the stacked vias by plating; and   filling the at least one stacked via with metal.   
     
     
         13 . The method of manufacturing a wiring board according to  claim 1 , further comprising:
 forming stacked vias in each of the insulation layers;   forming a conductive layer on an inner surface of at least one of the stacked vias by plating; and   filling the at least one stacked via with resin.   
     
     
         14 . The method of manufacturing a wiring board according to  claim 1 , wherein:
 the first substrate comprises a first lower-layer insulation layer and a first upper-layer insulation layer, and   the second substrate comprises a second lower-layer insulation layer and a second upper-layer insulation layer.   
     
     
         15 . The method of manufacturing a wiring board according to  claim 14 , further comprising:
 forming a conductive pattern on each of the upper-layer insulation layers;   forming a conductive pattern on each of the lower-layer insulation layers; and   connecting each conductive pattern on the upper-layer insulation layers to a respective conductive pattern on the lower-layer insulation layers through stacked vias.