US2011247784A1PendingUtilityA1

Fixing mechanism for fixing a heat-dissipating device and related thermal module

Assignee: YANG CHENG-HUNGPriority: Apr 8, 2010Filed: Nov 8, 2010Published: Oct 13, 2011
Est. expiryApr 8, 2030(~3.7 yrs left)· nominal 20-yr term from priority
Inventors:Cheng-Hung Yang
H10W 40/43F04D 25/0613F04D 29/601
33
PatentIndex Score
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Claims

Abstract

A fixing mechanism for fixing a heat-dissipating device includes a plurality of thermal fins whereon a ditch is formed, and a positioning device disposed on the plurality of thermal fins. The positioning device includes a supporting portion, and a first side of the supporting portion is for supporting the heat-dissipating device. The positioning device further includes a first constraining portion connected to a second side of the supporting portion and engaged with the ditch for preventing the supporting portion from moving relative to the plurality of thermal fins in a first direction, and a second constraining portion connected to the second side of the supporting portion and contacting against the plurality of thermal fins for preventing the supporting portion from moving relative to the plurality of thermal fins in a second direction different from the first direction.

Claims

exact text as granted — not AI-modified
1 . A fixing mechanism comprising:
 a plurality of thermal fins whereon a ditch is formed; and   a positioning device disposed on the plurality of thermal fins, the positioning device comprising:
 a supporting portion, a first side of the supporting portion being for supporting a heat-dissipating device; 
 a first constraining portion connected to a second side of the supporting portion and engaged inside the ditch for preventing the supporting portion from moving relative to the plurality of thermal fins in a first direction; and 
 a second constraining portion connected to the second side of the supporting portion and contacting against the plurality of thermal fins for preventing the supporting portion from moving relative to the plurality of thermal fins in a second direction different from the first direction. 
   
     
     
         2 . The fixing mechanism of  claim 1 , wherein a positioning hole is formed on the first side of the supporting portion, and the fixing mechanism further comprises a positioning component passing through the heat-dissipating device and fixed inside the positioning hole so as to fix the heat-dissipating device on the supporting portion. 
     
     
         3 . The fixing mechanism of  claim 1 , wherein a thickness of the first constraining portion is substantially equal to a width of the ditch so as to fix the positioning device on the plurality of thermal fins tightly. 
     
     
         4 . The fixing mechanism of  claim 3 , wherein the first constraining portion comprises a guiding structure for guiding the first constraining portion to engage inside the ditch. 
     
     
         5 . The fixing mechanism of  claim 4 , wherein an inclined angle of the guiding structure is substantially between 3 degrees and 5 degrees. 
     
     
         6 . The fixing mechanism of  claim 1 , wherein the positioning device is made of elastic material. 
     
     
         7 . The fixing mechanism of  claim 1 , wherein the positioning device is disposed between the heat-dissipating device and the plurality of thermal fins so that an interval is formed between the heat-dissipating device and the plurality of thermal fins. 
     
     
         8 . The fixing mechanism of  claim 1 , wherein the second constraining portion comprises two lateral walls contacting against outer sides of two thermal fins of the plurality of thermal fins, respectively. 
     
     
         9 . The fixing mechanism of  claim 1 , wherein the second constraining portion is a lateral wall clipped between two thermal fins of the plurality of thermal fins. 
     
     
         10 . A thermal module comprising:
 a heat-dissipating device; and   a fixing mechanism for fixing the heat-dissipating device, the fixing mechanism comprising:
 a plurality of thermal fins whereon a ditch is formed; and 
 a positioning device disposed on the plurality of thermal fins, the positioning device comprising:
 a supporting portion, a first side of the supporting portion being for supporting the heat-dissipating device; 
 a first constraining portion connected to a second side of the supporting portion and engaged inside the ditch for preventing the supporting portion from moving relative to the plurality of thermal fins in a first direction; and 
 a second constraining portion connected to the second side of the supporting portion and contacting against the plurality of thermal fins for preventing the supporting portion from moving relative to the plurality of thermal fins in a second direction different from the first direction. 
 
   
     
     
         11 . The thermal module of  claim 10 , wherein a positioning hole is formed on the first side of the supporting portion, and the fixing mechanism further comprises a positioning component passing through the heat-dissipating device and fixed inside the positioning hole so as to fix the heat-dissipating device on the supporting portion. 
     
     
         12 . The thermal module of  claim 10 , wherein a thickness of the first constraining portion is substantially equal to a width of the ditch so as to fix the positioning device on the plurality of thermal fins tightly. 
     
     
         13 . The thermal module of  claim 12 , wherein the first constraining portion comprises a guiding structure for guiding the first constraining portion to engage inside the ditch. 
     
     
         14 . The thermal module of  claim 13 , wherein an inclined angle of the guiding structure is substantially between 3 degrees and 5 degrees. 
     
     
         15 . The thermal module of  claim 10 , wherein the positioning device is made of elastic material. 
     
     
         16 . The thermal module of  claim 10 , wherein the positioning device is disposed between the heat-dissipating device and the plurality of thermal fins so that an interval is formed between the heat-dissipating device and the plurality of thermal fins. 
     
     
         17 . The thermal module of  claim 10 , wherein the second constraining portion comprises two lateral walls contacting against outer sides of two thermal fins of the plurality of thermal fins, respectively. 
     
     
         18 . The thermal module of  claim 10 , wherein the second constraining portion is a lateral wall clipped between two thermal fins of the plurality of thermal fins. 
     
     
         19 . The thermal module of  claim 10 , wherein the heat-dissipating device is a fan.

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