Method and system for managing semiconductor manufacturing device

Abstract

A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.

1 . (canceled) 
     
     
         2 . (canceled) 
     
     
         3 . A management system that manages a semiconductor manufacturing device, the management system comprising:
 a first storage unit that stores therein a plurality of quality-control values, the quality-control values being values obtained by measuring a dimension of wafers at different times during processing of the wafers by the semiconductor manufacturing device;   a second storage unit that stores therein a plurality of equipment parameters, the equipment parameters being values obtained by monitoring a state of the semiconductor manufacturing device at different times during processing of the wafers by the semiconductor manufacturing device;   a third storage unit that stores therein a maintenance log of the semiconductor manufacturing device;   a first setting unit that sets a correction value for correcting the equipment parameters to control the quality-control values based on the quality-control values in the first storage unit and the equipment parameters in the second storage unit;   a fourth storage unit that stores therein the correction value set by the first setting unit;   a detecting unit that detects an abnormality in the state of the semiconductor manufacturing device based on monitoring of the equipment parameters and an error detection rule, the error detection rule is for determining an abnormality in the state of the semiconductor manufacturing device;   an acquiring unit that acquires events from the third storage unit and the fourth storage unit, the events including a maintenance of the semiconductor manufacturing device stored in the third storage unit and a change of the correction value stored in the fourth storage unit;   a determining unit that determines whether the events acquired by the second acquiring unit are associated with the equipment parameters monitored by the detecting unit; and   an instructing unit that outputs an instruction indicative of a necessity to update the error detection rule when it is determined by the determining unit that the events are associated with the equipment parameters.   
     
     
         4 . The management system according to  claim 3 , wherein when it is determined by the determining unit that the events are associated with the parameters, the instructing unit outputs an instruction to the detecting unit to automatically update the error detection rule. 
     
     
         5 . The management system according to  claim 3 , wherein when the semiconductor manufacturing device is an exposure device, the equipment parameters monitored by the detecting unit include one or more of following:
 (1) synchronization accuracy between a wafer stage and a reticle stage   (2) orthogonality of a wafer   (3) relative magnification of a reticle image   (4) delay in a processing between a developing process and an exposure process, and   the detecting unit outputs an instruction indicative of a necessity to perform a maintenance of the exposure device when detecting an error in a resist width based on an error detection rule that is used for detecting error in equipment parameters associated with a resist width.   
     
     
         6 . The management system according to  claim 4 , wherein when the semiconductor manufacturing device is an exposure device, the equipment parameters monitored by the detecting unit include one or more of following:
 (1) synchronization accuracy between a wafer stage and a reticle stage   (2) orthogonality of a wafer   (3) relative magnification of a reticle image   (4) delay in a processing between a developing process and an exposure process, and   the detecting unit outputs an instruction indicative of a necessity to perform a maintenance of the exposure device when detecting an error in a resist width based on an error detection rule that is used for detecting error in equipment parameters associated with a resist width.   
     
     
         7 . A method of managing a semiconductor manufacturing device, the method comprising:
 acquiring events, the events including a maintenance of the semiconductor manufacturing device and a change of a correction value, the correction value being a value for correcting equipment parameters to control quality-control values based on the quality-control values, the equipment parameters being values obtained by monitoring a state of the semiconductor manufacturing device at different times during processing of wafers by the semiconductor manufacturing device, the quality-control values being values obtained by measuring a dimension of the wafers at different times during processing of the wafers by the semiconductor manufacturing device;   determining whether the events acquired at the acquiring are associated with the equipment parameters being monitored by a detecting unit that detects an abnormality in the state of the semiconductor manufacturing device based on monitoring of the equipment parameters and an error detection rule, the error detection rule is for determining an abnormality in the state of the semiconductor manufacturing device; and   outputting an instruction indicative of a necessity to update the error detection rule when it is determined at the determining that the events acquired at the acquiring are associated with the equipment parameters monitored by the detecting unit.   
     
     
         8 . The method according to  claim 7 , wherein the outputting includes outputting an instruction to the detecting unit to automatically update the error detection rule when it is determined at the determining that the events acquired at the acquiring are associated with the equipment parameters monitored by the detecting unit. 
     
     
         9 . The method according to  claim 7 , wherein when the semiconductor manufacturing device is an exposure device, the equipment parameters monitored by the detecting unit include one or more of following:
 (1) synchronization accuracy between a wafer stage and a reticle stage   (2) orthogonality of a wafer   (3) relative magnification of a reticle image   (4) delay in a processing between a developing process and an exposure process, and   the detecting unit outputs an instruction indicative of a necessity to perform a maintenance of the exposure device when detecting an error in a resist width based on an error detection rule that is used for detecting error in equipment parameters associated with a resist width.   
     
     
         10 . The method according to  claim 8 , wherein when the semiconductor manufacturing device is an exposure device, the equipment parameters monitored by the detecting unit include one or more of following:
 (1) synchronization accuracy between a wafer stage and a reticle stage   (2) orthogonality of a wafer   (3) relative magnification of a reticle image   (4) delay in a processing between a developing process and an exposure process, and   the detecting unit outputs an instruction indicative of a necessity to perform a maintenance of the exposure device when detecting an error in a resist width based on an error detection rule that is used for detecting error in equipment parameters associated with a resist width.