US2011232869A1PendingUtilityA1

Air Conditioner Eliminator System and Method for Computer and Electronic Systems

Individually held — no corporate assignee on recordPriority: Dec 5, 2008Filed: Dec 5, 2009Published: Sep 29, 2011
Est. expiryDec 5, 2028(~2.4 yrs left)· nominal 20-yr term from priority
G06F 1/20G06F 2200/201
48
PatentIndex Score
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Cited by
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Claims

Abstract

A computer and electronic systems air conditioner eliminator heat exchange system and method for efficiently removing thermal energy or heat from heat-generating, thermally-sensitive equipment such as computer systems, electronic devices and other electronic equipment. The system in at least one embodiment includes one or more cooling caps ( 114, 214 ), one or more heat exchangers ( 112, 154, 212, 254, 412 ) and one or more pumps ( 118, 158, 218, 258, 418 ) to remove heat from the heat-generating equipment ( 190 ) and transfer that heat to a remote location from where the heat-generating equipment is located. The system and method in at least one embodiment perform this heat-exchange process without significantly losing any thermal energy to the atmosphere of the structure or room housing the heat-generating equipment.

Claims

exact text as granted — not AI-modified
1 . An apparatus for efficiently removing heat from heat-generating electronic equipment having at least one electrical component, said apparatus comprising:
 a first closed-loop system having
 a first heat exchanger having an inlet and an outlet, and 
 at least one cooling cap in fluid communication with said first heat exchanger such that fluid flows from the outlet of said first heat exchanger to said at least one cooling cap and fluid flows from said at least one cooling cap to the inlet of said first heat exchanger; and 
   a second closed-loop system having
 a thermal fluid reservoir in thermal communication with said first heat exchanger, said thermal fluid reservoir having an inlet and an outlet, and 
 a second heat exchanger in fluid communication with said thermal fluid reservoir, said second heat exchanger having an inlet and an outlet, the inlet of said second heat exchanger is in fluid communication with the outlet of said thermal fluid reservoir and the outlet of said second heat exchanger is in fluid communication with the inlet of said thermal fluid reservoir; and 
   wherein said second heat exchanger is at a remote location from said thermal fluid reservoir.   
     
     
         2 . The apparatus according to  claim 1 , wherein said first closed-loop system further includes
 a fluid reservoir in fluid communication with the outlet of said first heat exchanger, said fluid reservoir having an opening through at least one wall,   a first pump in fluid communication with said fluid reservoir and said at least one cooling cap.   
     
     
         3 . The apparatus according to  claim 2 , wherein said first closed-loop system further includes at least one conduit connecting said first pump to said at least one cooling cap,
 said first pump includes a submersible pump located in said fluid reservoir, said first pump having an outlet in fluid communication with one of said at least one conduit where said one of said at least one conduit passes through the opening of said fluid reservoir.   
     
     
         4 . The apparatus according to  claim 1 , wherein said first closed-loop system further includes a first pump in fluid communication with said first heat exchanger and said at least one cooling cap, said first pump located between the outlet of said first heat exchanger and said at least one cooling cap. 
     
     
         5 . The apparatus according to  claim 1 , wherein said first closed-loop system further includes a first pump in fluid communication with said first heat exchanger and said at least one cooling cap, said first pump located between the inlet of said first heat exchanger and said at least one cooling cap. 
     
     
         6 . The apparatus according to  claim 4 , wherein said first closed-loop system further includes a fluid reservoir in which said first pump is located. 
     
     
         7 . The apparatus according to  claim 2 , wherein said second heat exchanger includes a second pump. 
     
     
         8 . The apparatus according to  claim 1 , wherein said second closed-loop system further includes a pump in fluid communication with said second heat exchanger and said thermal fluid reservoir, said pump located between the outlet of said second heat exchanger and the inlet of said thermal fluid reservoir. 
     
     
         9 . The apparatus according to  claim 1 , wherein said second closed-loop system further includes a pump in fluid communication with said second heat exchanger and said thermal fluid reservoir, said pump located between the inlet of said second heat exchanger and the outlet of said thermal fluid reservoir. 
     
     
         10 . The apparatus according to  claim 1 , wherein said second heat exchanger includes a second pump. 
     
     
         11 . The apparatus according to  claim 1 , wherein said second heat exchanger further includes
 a plurality of channels through which fluid passes between the inlet and the outlet of said second heat exchanger, and   at least one fan positioned to move air pass said plurality of channels.   
     
     
         12 . The apparatus according to  claim 1 , wherein fluid communication is provided through a plurality of conduit. 
     
     
         13 . The apparatus according to  claim 1 , further comprising
 an inert fluid in said first closed-loop system, and   a second fluid in said second closed-loop system.   
     
     
         14 . The apparatus according to  claim 13 , wherein said second fluid includes water. 
     
     
         15 . A system comprising:
 a structure having a room or space,   a plurality of electronic equipment having at least one electrical component to have heat transferred from, where said plurality of electronic equipment is located in said room or space of said structure,   at least one heat exchanger system having at least one of said apparatus according to  claim 1  connected to at least one of said plurality of electronic equipment, wherein for each electrical component of the connected plurality of electronic equipment at least one of said at least one cooling cap is attached to said electrical component, said first closed-loop system is located in said room and said second heat exchanger is at a remote location from said room.   
     
     
         16 . The system according to  claim 15 , wherein at least two apparatus share a common second heat exchanger. 
     
     
         17 . (canceled) 
     
     
         18 . An apparatus for efficiently removing heat from heat-generating electronic equipment, comprising:
 a first pump;   at least one cooling cap in fluid communication with said first pump, said cooling caps containing a thermally conductive metal and capable of thermally connecting to one or more electronic devices;   a sealed heat exchange unit in fluid communication with said cooling caps and said first pump, said sealed heat exchange unit comprising:
 a sealed fluid reservoir containing a fluid; and 
 a first heat exchanger disposed within said sealed fluid reservoir; 
   a second heat exchanger in fluid communication with said sealed heat exchange unit, wherein said second heat exchanger is located on the exterior of a room containing said first heat exchanger; and   a second pump in fluid communication with said second heat exchanger and said sealed heat exchange unit.   
     
     
         19 . The apparatus according to  claim 18 , further comprising:
 an inert fluid reservoir containing inert fluid, wherein said first pump is disposed in said inert fluid reservoir.   
     
     
         20 . The apparatus according to  claim 18 , further comprising:
 one or more fans in thermal communication with said second heat exchanger.   
     
     
         21 . The apparatus according to  claim 18 , further comprising:
 at least one first conduit connecting said first pump to said at least one cooling cap;   at least one second conduit connecting said at least one cooling cap to said first heat exchanger;   at least one third conduit connecting said first heat exchanger to said first pump;   at least one fourth conduit connecting said sealed fluid reservoir to said second heat exchanger;   at least one fifth conduit connecting said second heat exchanger to said second pump;   at least one sixth conduit connecting said second pump to said sealed fluid reservoir;   said at least one first conduit, said at least one second conduit, said at least one third conduit, said first pump, said at least one cooling cap, and said first heat exchanger form a closed fluid loop; and   said at least one fourth conduit, said at least one fifth conduit, said at least one sixth conduit, said second pump, said sealed fluid reservoir, and said second heat exchanger for a second closed fluid loop.   
     
     
         22 . (canceled) 
     
     
         23 . A method comprising:
 pumping a first fluid through at least one cooling cap attached to at least one heat producing component;   moving the first fluid from the cooling cap to a first heat exchange unit;   transferring heat from the first fluid to a second fluid in the first heat exchange unit;   recycling the first fluid back to the cooling cap;   moving the second fluid to an external heat exchanger located outside of an environment where the first heat exchange unit is located;   transferring heat from the second fluid to the environment in the external heat exchanger; and   moving the second fluid back to the first heat exchange unit.   
     
     
         24 . (canceled) 
     
     
         25 . (canceled) 
     
     
         26 . (canceled) 
     
     
         27 . (canceled) 
     
     
         28 . (canceled)

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