Composite polishing pad

Abstract

An abrasive article referred to as composite polishing pad (CPP) includes a plurality of fixed abrasive elements or a plurality of chemical mechanical polishing (CMP) pads attached to a plurality of pressure pads suspended to flexible structures capable to follow the wafer topography. A plurality of stems with dimpled ends act on the pressure pads to generate desired pressure acting on the wafer. The stems are attached to a spring arrangement capable of substantial vertical deflection under a desired load. In one embodiment a plurality of pressure pads suspended to a plurality of stems by revolute joints. The stems are attached to a spring arrangement capable of substantial vertical deflection under a desired load. In another embodiment, a plurality of pressure pads are attached to a plurality of stems suspended to a series of springs capable of substantial vertical deflection under a desired load.

1 . A polishing pad comprising:
 an abrasive element;   a pivoting flexure formed around the abrasive element and attached to the abrasive element, the abrasive element including a plurality of abrasive particles, the pivoting flexure including a dimple to allow pivoting of the abrasive element;   (d) a stem supported by a preload flexure, the stem positioned to apply a load through the dimple of the pivoting flexure,   (e) a plurality of pillars affixed to a plurality of preload flexures arranged in a layer to provide fixed boundary conditions for the edges of pivoting flexure, and   (f) an opening made in the carrier that allows for the preload flexure to move vertically.   
     
     
         2 . The polishing pad of  claim 1 , wherein the fixed abrasive elements are in a rectangular shape. 
     
     
         3 . The polishing pad of  claim 1 , wherein the fixed abrasive elements are in a circular shape 
     
     
         4 . A polishing pad comprising:
 a polishing pad,   a pivoting flexure formed around the polishing pads hold the polishing pads, the polishing pad affixed to pivoting flexure,   a stem supported by a preload flexure, the stem applying a load through a dimple pn the pivoting flexure,   a plurality of pillars affixed to a preload flexure layer to provide fixed boundary conditions for the edges of pivoting flexure, and   an opening made in the carrier allows for the preload flexure to move vertically with substantially no interference.   
     
     
         5 . The polishing pad of  claim 4 , wherein the polishing pad is one of a plurality of polishing pads arranged in a rectangular shape. 
     
     
         6 . The polishing pad of  claim 4 , wherein the polishing pad is one of a plurality of polishing pads arranged in a circular shape. 
     
     
         7 . A polishing comprising a) a polishing pad element, b) the polishing pad elements are affixed to a pivoting flexure, (c) a pivoting flexure formed around the fixed abrasive elements hold the abrasive element, (d) a stem supported by a preload flexure to apply a load through a dimple on the pivoting flexure, (e) a plurality of pillars affixed to the preload flexure layer provide fixed boundary conditions for the edges of pivoting flexure, and (f) an opening made in the carrier allows for the preload flexure to move vertically with substantially no interference. 
     
     
         8 . The polishing pad of  claim 7 , wherein the polishing pad is one of a plurality of polishing pads arranged in a rectangular shape. 
     
     
         9 . The polishing pad of  claim 7 , wherein the polishing pad is one of a plurality of polishing pads arranged in a circular shape. 
     
     
         10 . The polishing pad of  claim 7 , wherein the polishing pad is one of a plurality of polishing pads arranged in a rectangular shape. 
     
     
         11 . The polishing pad of  claim 7 , wherein the polishing pad is one of a plurality of polishing pads arranged in a circular shape. 
     
     
         12 . The polishing pad of  claim 7 , wherein at least one of the polishing pads is fabricated for chemical mechanical polishing (CMP) applications. 
     
     
         13 . The polishing pad of  claim 7 , wherein at least on of the polishing pads contains abrasive particles. 
     
     
         14 . A polishing pad, comprising:
 a plurality of flexible flexures with flexibility in a direction transverse to the plane defined by the polishing plane, and   a plurality of polishing elements each attached via stems to a the flexible flexures applying a desired pressure in the transverse direction with respect to the polishing pad in order to contact and polish the workpiece.   
     
     
         15 . The pad of  claim 17 , wherein at least one of the polishing elements has a circular cross sections. 
     
     
         16 . The pad of  claim 17 , wherein at least one of the polishing elements has a rectangular cross sections. 
     
     
         17 . A polishing pad, comprising:
 a plurality of flexible flexures with flexibility in a substantially vertical direction to the plane defined by the polishing plane, and   a plurality of pressure pads each connected via spherical joints to the stems attached to the pivoting flexures applying a desired pressure in a vertical direction with respect to the polishing pad in order to contact and polish the workpiece.   
     
     
         18 . The polishing pad of  claim 17 , wherein at least one of the polishing elements has circular cross sections. 
     
     
         19 . The polishing pad of  claim 17 , wherein at least one of the polishing elements has rectangular cross sections. 
     
     
         20 . A polishing pad comprising:
 a plurality of individual polishing pads, and   at least one in-plane non straight links connecting adjacent polishing pads.   
     
     
         21 . The polishing pad of  claim 20 , wherein the polishing pads are in a rectangular shape. 
     
     
         22 . The polishing pad of  claim 20 , wherein the polishing pads are in a circular shape. 
     
     
         23 . The polishing pad of  claim 20 , wherein at least on of the polishing pads is fabricated for CMP applications. 
     
     
         24 . The polishing pad of  claim 20 , wherein at least on of the polishing pads contains abrasive particles. 
     
     
         25 . The polishing pad of  claim 20 , wherein at least on of the polishing pads is textured and substantially covered with a deposited film, such as diamond like carbon (DLC).