Device for monitoring an environment of a vehicle
Abstract
The invention relates to a device for monitoring an environment of a vehicle, wherein the environment is captured by means of a plurality of image capturing units, the capture ranges ( 2 ) thereof at least partially overlapping each other and forming an overlap range ( 3 ), wherein an overall image is generated from the individual images captured by means of the image capturing units by means of an image processing unit, said overall image showing the vehicle and the environment thereof from a bird's-eye view. According to the invention, the image capturing units are designed as wafer-level cameras ( 1 ).
Claims
exact text as granted — not AI-modified1 . A device for monitoring an environment of a vehicle, wherein the environment is captured by means of a plurality of image capturing units, the capture ranges ( 2 ) thereof at least partially overlapping each other and forming an overlap range ( 3 ), wherein an overall image is generated from the individual images captured by means of the image capturing units by means of an image processing unit, which overall image shows the vehicle and the environment thereof from a bird's-eye view,
wherein the image capturing units are wafer-level cameras ( 1 ).
2 . The device according to claim 1 , wherein several wafer-level cameras ( 1 ) are arranged parallel adjacent to each other in the form of a line.
3 . The device according to claim 1 , wherein the wafer-level cameras ( 1 ) are arranged at the sides of a vehicle body in an integrated manner.
4 . The device according to claim 1 , wherein two wafer-level cameras ( 1 ) of a line simultaneously record an image and transfer it to the image processing unit.
5 . The device according to claim 4 , wherein the distance between two wafer-level cameras ( 1 ) is variable.
6 . The device according to claim 1 , wherein a display device for depicting the overall image is provided.
7 . The device according to claim 1 , wherein the image processing unit is arranged in the immediate spatial proximity to the wafer level cameras ( 1 ) in the vehicle.
8 . The device according to claim 1 , wherein the device is mounted on the vehicle, wherein the vehicle has a body, and wherein the wafer-level cameras ( 1 ) are integrated in the sides of the vehicle body.Join the waitlist — get patent alerts
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