Multi-function card device

Abstract

A multifunction card device has an external connection terminal, an interface controller, a memory, and the security controller connected to the interface controller and the external connection terminal. The interface controller has a plurality of interface control modes, and controls an external-interface action and a memory interface action by the control mode according to the instruction from the outside. The external connection terminals have an individual terminal individualized for every interface control mode, and a communalized common terminal. A clock input terminal, a power supply terminal, and an earthing terminal are included in the common terminals. A data terminal, and a dedicated terminal of the security controller are included in the individual terminals. Partial communalization and individualization of an external connection terminal attain a guarantee of the reliability of an interface, and increase control of physical magnitude to some kinds of interface control modes. The security process by a security controller independent interface can also be guaranteed.

1 - 62 . (canceled) 
     
     
         63 . A semiconductor card device with which a semiconductor chip mounted over a wiring substrate was sealed by a package, wherein
 at least two level difference parts stopped by a socket are formed in a thickness direction of the package.   
     
     
         64 . A semiconductor card device according to  claim 63 , wherein the package is a package formed with a mold array package form. 
     
     
         65 . A semiconductor card device according to  claim 63 , wherein the two level difference parts are unsymmetrical. 
     
     
         66 . A semiconductor card device according to  claim 63 , wherein external connection terminals exposed out of the package are
 non-line symmetry to a center of the package.   
     
     
         67 . A semiconductor card device according to  claim 66 , wherein
 the external connection terminals exposed out of the package are arranged in parallel by plural lines, and the plural lines have deviation to the level difference part of the package.   
     
     
         68 . A semiconductor card device according to  claim 66 , wherein
 the external connection terminals exposed out of the package are arranged in parallel by plural lines, and the plural lines have deviation mutually to a parallel direction.   
     
     
         69 - 75 . (canceled)