US2011226451A1PendingUtilityA1

Cooling device and electronic device including the same

Assignee: SONY COMPUTER ENTERTAINMENT INCPriority: Mar 17, 2010Filed: Mar 15, 2011Published: Sep 22, 2011
Est. expiryMar 17, 2030(~3.6 yrs left)· nominal 20-yr term from priority
H05K 7/20163G06F 1/20
43
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Claims

Abstract

A cooling device includes: a heat sink including a plurality of fins formed to be plate shaped, which are arranged in parallel to one another; and a cooling fan arranged in a direction from the heat sink, the direction being perpendicular to perpendicular lines of the fins. A plurality of fins of a side heat sink constituting the heat sink include edges aligned on an oblique line with respect to perpendicular lines of the fins and formed on the outer periphery of the cooling fan. With this structure, it is possible to improve usage efficiency of an air flow generated by the cooling fan.

Claims

exact text as granted — not AI-modified
1 . A cooling device, comprising:
 a heat sink including a plurality of fins formed to be plate shaped and aligned at intervals, the heat sink being arranged such that perpendicular line of any one of the plurality of fins are along a first direction; and   a cooling fan situated from the plurality of fins in a second direction perpendicular to the first direction, the cooling fan being rotatable about a center line along a third direction perpendicular to both the first direction and the second direction, wherein:   the heat sink includes a plurality of oblique arrangement fins serving as at least one part of the plurality of fins; and   the plurality of oblique arrangement fins include edges aligned on an oblique line with respect to the first direction and formed on an outer periphery of the cooling fan.   
     
     
         2 . The cooling device according to  claim 1 , wherein the heat sink includes a first heat sink provided with the plurality of oblique arrangement fins, and a second heat sink arranged next to the first heat sink and surrounding one part of the outer periphery of the cooling fan together with the first heat sink. 
     
     
         3 . The cooling device according to  claim 2 , wherein the second heat sink includes the plurality of fins formed to be plate shaped, which are arranged in parallel to one another and aligned at the intervals. 
     
     
         4 . The cooling device according to  claim 3 , wherein:
 the plurality of oblique arrangement fins of the first heat sink are aligned at regular intervals; and   An oblique arrangement fin situated at an end of the first heat sink and a fin situated at an end of the second heat sink have an interval therebetween which is same as the regular intervals.   
     
     
         5 . The cooling device according to  claim 3 , wherein:
 the plurality of fins of the second heat sink are aligned at regular intervals; and   An oblique arrangement fin situated at an end of the first heat sink and a fin situated at an end of the second heat sink have an interval therebetween which is same as the regular intervals.   
     
     
         6 . The cooling device according to  claim 1 , wherein the edges of the plurality of oblique arrangement fins are aligned on a straight line oblique with respect to the first direction and formed on the outer periphery of the cooling fan. 
     
     
         7 . The cooling device according to  claim 6 , wherein edges opposite to the edges of the plurality of oblique arrangement fins are aligned on another straight line which extends in a direction along the straight line. 
     
     
         8 . The cooling device according to  claim 6 , wherein:
 the heat sink includes a base portion formed into a plate shape;   the plurality of oblique arrangement fins are formed to be upright on the base portion; and   the plurality of oblique arrangement fins and the base portion are formed integrally with each other by extruding in which a material is extruded in a direction parallel to the plurality of oblique arrangement fins.   
     
     
         9 . The cooling device according to  claim 1 , further comprising a heat transfer member arranged under the plurality of oblique arrangement fins, for transferring heat of an electronic component on a circuit board to the plurality of oblique arrangement fins,
 wherein one part of the plurality of oblique arrangement fins is situated on one side with respect to the heat transfer member, and another part of a plurality of oblique arrangement fins is situated on the other side with respect to the heat transfer member.   
     
     
         10 . An electronic device, comprising the cooling device according to  claim 1  built therein.

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