Copper alloy sheet

Abstract

The present invention relates to a Cu—Ni—Sn—P-based copper alloy sheet having a specific composition, where (1) the copper alloy sheet is set to have an electrical conductivity of 32% IACS or more, a stress relaxation ratio in the direction parallel to the rolling direction of 15% or less, a 0.2%-proof stress of 500 MPa or more and an elongation of 10% or more; (2) the X-ray diffraction intensity ratio I(200)/I(220) in the sheet surface is set to be a given value or less and at the same time, anisotropy in the stress relaxation resistance characteristic is reduced by fining the grain size; (3) the texture of the copper alloy sheet is set to a texture such that the distribution density of B orientation and the sum of distribution densities of B orientation, S orientation and Cu orientation each is set to fall in a specific range and bendability is thereby enhanced; or (4) the dislocation density measured using the value obtained by dividing the half-value breadth of the X-ray diffraction intensity peak from {200} plane in the copper alloy sheet surface by the peak height is set to a given value or more and press punchability is thereby enhanced. The Cu—Ni—Sn—P-based copper alloy sheet of the present invention is excellent in the properties required for a terminal or connector and further (1) has excellent strength-ductility balance, (2) satisfies the stress relaxation resistance characteristic in the direction orthogonal to the rolling direction, (3) has excellent bendability, or (4) has excellent press punchability.

1 . A copper alloy sheet comprising, in terms of mass %, 0.1 to 3.0% of Ni, 0.01 to 3.0% of Sn and 0.01 to 0.3% of P, with the balance being copper and inevitable impurities, wherein the copper alloy sheet has, as terminal/connector properties, an electrical conductivity of 32% IACS or more and a stress relaxation ratio in the direction parallel to the rolling direction of 15% or less and further has, as mechanical properties, a 0.2%-proof stress of 500 MPa or more and an elongation of 10% or more. 
     
     
         2 . The copper alloy sheet as claimed in  claim 1 , wherein the copper alloy sheet has an intensity peak at the X-ray diffraction angle (2θ) between 100° and 102° in the X-ray diffraction pattern. 
     
     
         3 . The copper alloy sheet as claimed in  claim 1 , wherein the copper alloy sheet has an electrical conductivity of 35% IACS or more and further has, as mechanical properties, a 0.2%-proof stress of 520 MPa or more and an elongation of 12% or more. 
     
     
         4 . A copper alloy sheet comprising, in terms of mass %, 0.1 to 3.0% of Ni, 0.01 to 3.0% of Sn and 0.01 to 0.3% of P, with the balance being copper and inevitable impurities, wherein the copper alloy sheet has a ratio I(200)/I(220) of a X-ray diffraction intensity I(200) from (200) plane in the sheet surface to a X-ray diffraction intensity I(220) from (220) plane in the sheet surface of 0.25 or less, and has an average grain size of 5.0 □m or less. 
     
     
         5 . A copper alloy sheet comprising, in terms of mass %, 0.1 to 3.0% of Ni, 0.01 to 3.0% of Sn and 0.01 to 0.3% of P, with the balance being copper and inevitable impurities, wherein the copper alloy sheet has a texture in which a distribution density of Brass orientation is 40% or less and a sum of distribution densities of Brass orientation, S orientation and Copper orientation is 30 to 90%. 
     
     
         6 . A copper alloy sheet comprising, in terms of mass %, 0.1 to 3.0% of Ni, 0.01 to 3.0% of Sn and 0.01 to 0.3% of P, with the balance being copper and inevitable impurities, wherein a value obtained by dividing a half-value breadth of a X-ray diffraction intensity peak from {200} plane in the sheet surface by a height of the peak is 1.0 □ 10-4 or more. 
     
     
         7 . The copper alloy sheet as claimed in  claim 1 , which further comprises at least one member selected from the group consisting of, in terms of mass %, 0.5% or less of Fe, 1% or less of Zn, 0.1% or less of Mn, 0.1% or less of Si and 0.3% or less of Mg. 
     
     
         8 . The copper alloy sheet as claimed in  claim 1 , which further comprises at least one member selected from the group consisting of Ca, Zr, Ag, Cr, Cd, Be, Ti, Co, Au and Pt, in a total amount of 1.0 mass % or less. 
     
     
         9 . The copper alloy sheet as claimed in  claim 1 , which further comprises at least one member selected from the group consisting of Hf, Th, Li, Na, K, Sr, Pd, W, S, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Bi, Te, B and Misch metal, in a total amount of 0.1 mass % or less. 
     
     
         10 . The copper alloy as claimed in  claim 4 , which further comprises at least one member selected from the group consisting of in terms of mass %, 0.5% or less of Fe, 1% or less of Zn, 0.1% or less of Mn, 0.1% or less of Si and 0.3% or less of Mg. 
     
     
         11 . The copper alloy as claimed in  claim 5 , which further comprises at least one member selected from the group consisting of in terms of mass %, 0.5% or less of Fe, 1% or less of Zn, 0.1% or less of Mn, 0.1% or less of Si and 0.3% or less of Mg. 
     
     
         12 . The copper alloy as claimed in  claim 6 , which further comprises at least one member selected from the group consisting of in terms of mass %, 0.5% or less of Fe, 1% or less of Zn, 0.1% or less of Mn, 0.1% or less of Si and 0.3% or less of Mg. 
     
     
         13 . The copper alloy as claimed in  claim 4 , which further comprises at least one member selected from the group consisting of Ca, Zr, Ag, Cr, Cd, Be, Ti, Co, Au and Pt, in a total amount of 1.0 mass % or less. 
     
     
         14 . The copper alloy as claimed in  claim 5 , which further comprises at least one member selected from the group consisting of Ca, Zr, Ag, Cr, Cd, Be, Ti, Co, Au and Pt, in a total amount of 1.0 mass % or less. 
     
     
         15 . The copper alloy as claimed in  claim 6 , which further comprises at least one member selected from the group consisting of Ca, Zr, Ag, Cr, Cd, Be, Ti, Co, Au and Pt, in a total amount of 1.0 mass % or less. 
     
     
         16 . The copper alloy as claimed in  claim 4 , which further comprises at least one member selected from the group consisting of Hf, Th, Li, Na, K, Sr, Pd, W, S, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Bi, Te, B and Misch metal, in a total amount of 0.1 mass % or less. 
     
     
         17 . The copper alloy as claimed in  claim 5 , which further comprises at least one member selected from the group consisting of Hf, Th, Li, Na, K, Sr, Pd, W, S, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Bi, Te, B and Misch metal, in a total amount of 0.1 mass % or less. 
     
     
         18 . The copper alloy as claimed in  claim 6 , which further comprises at least one member selected from the group consisting of Hf, Th, Li, Na, K, Sr, Pd, W, S, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Bi, Te, B and Misch metal, in a total amount of 0.1 mass % or less.