Thermoelectric heterostructure assemblies element

Abstract

Improved thermoelectric assemblies are disclosed, wherein layers of heterostructure thermoelectric materials or thin layers of thermoelectric material form thermoelectric elements. The layers are bound together with agents that improve structural strengths, allow electrical current to pass in a preferred direction, and minimize or reduce adverse affects, such a shear stresses, that might occur to the thermoelectric properties and materials of the assembly by their inclusion.

1 . A thermoelectric element comprising:
 a first heterostructure thermoelectric portion and a second heterostructure thermoelectric portion, the first and second thermoelectric portions of the same conductivity type and electrically coupled in series to one another such that current flows from the first heterostructure thermoelectric portion to the second heterostructure thermoelectric portion; and   an electrically conductive material coupled to the first and second hetero structure thermoelectric portions.   
     
     
         2 . The thermoelectric element of  claim 1 , wherein the electrically conductive material comprises at least one electrode. 
     
     
         3 . The thermoelectric element of  claim 1 , wherein the first and second heterostructure thermoelectric portions form layers. 
     
     
         4 . The thermoelectric element of  claim 3 , wherein the electrically conductive material is coupled to the layers at least one end of the layers. 
     
     
         5 . The thermoelectric element of  claim 3 , wherein the electrically conductive material is coupled to at least the top or bottom of the layers. 
     
     
         6 . The thermoelectric element of  claim 1 , wherein the first and second heterostructure thermoelectric portions form wires. 
     
     
         7 . The thermoelectric element of  claim 6 , wherein the electrically conductive material comprises at least one electrode. 
     
     
         8 . The thermoelectric element of  claim 7 , wherein the electrically conductive material is coupled to the wires at least one end of the wires. 
     
     
         9 . The thermoelectric element of  claim 7 , wherein the electrically conductive material is coupled to at least the top or bottom of the wires. 
     
     
         10 . The thermoelectric element of  claim 1 , further comprising a bonding material between the first and second heterostructure thermoelectric portions. 
     
     
         11 . The thermoelectric element of  claim 10 , wherein the bonding material is configured to reduce the power density of the thermoelectric. 
     
     
         12 . The thermoelectric element of  claim 10 , wherein the bonding material is configured to reduce shear stress in the first and second heterostructure thermoelectric portions when the thermoelectric element is operated. 
     
     
         13 . The thermoelectric element of  claim 1 , further comprising an intermediate material between at least one of the first and second heterostructure thermoelectric portions and the electrically conductive material. 
     
     
         14 . The thermoelectric element of  claim 13 , wherein the intermediate material is configured to reduce shear stress in the first and second heterostructure thermoelectric portions when the thermoelectric element is operated. 
     
     
         15 . The thermoelectric element of  claim 14 , wherein the intermediate material is resilient. 
     
     
         16 . The thermoelectric element of  claim 1 , wherein the first and second heterostructure thermoelectric portions are of substantially the same thermoelectric material. 
     
     
         17 . The thermoelectric element of  claim 1 , wherein at least one of the first and second heterostructure thermoelectric portions comprises at least two layers of hetero structure thermoelectric material. 
     
     
         18 . A method of producing a thermoelectric device comprising the steps of:
 layering first and second heterostructure thermoelectric segments to be electrically coupled in series to one another such that current flows from the first heterostructure thermoelectric segment to the second heterostructure thermoelectric segment; and   connecting at least one electrode to the segments.   
     
     
         19 . The method of  claim 18 , wherein the step of layering comprises bonding said first and second heterostructure thermoelectric segments with a bonding material. 
     
     
         20 . The method of  claim 19 , further comprising the step of providing an intermediate material between at least one of the heterostructure thermoelectric segments and the at least one electrode.