Manufacturing method of a holder of a boat for loading a substrate

Abstract

A manufacturing method of a holder of the boat for loading a semiconductor substrate includes molding a holder substrate of a pipe shape having inner and outer circumference of a predetermined size in such a manner that a lower portion of the semiconductor substrate is seated thereon, and forming a plurality of holder rings by cutting the holder rings from the holder substrate in such a manner that each holder ring is matched to a disposal interval of the semiconductor substrates in the boat. The manufacture of the holder and the batch type boat are simple by means of the holder ring supported on the supporting rods and the end-effector escapes the supporting rods, so that the pitch interval can be minimized, whereby it can load the compact semiconductor substrate to the boat, the amount of the substrate treatment can be improved and thus the productivity thereof can be improved.

1 - 15 . (canceled) 
     
     
         16 . A manufacturing method of a holder of a boat for loading a semiconductor substrate comprising the steps of:
 molding a holder substrate of a pipe shape having inner and outer circumference of a predetermined size in such a manner that a lower portion of the semiconductor substrate is seated thereon; and   forming a plurality of holder rings by cutting the holder rings from the holder substrate in such a manner that each holder ring is matched to a disposal interval of the semiconductor substrates in the boat.   
     
     
         17 . A manufacturing method as claimed in  claim 16 , wherein the holder substrate of the pipe shape is powder-molded through a silicon carbide powder and a silicon carbide is coated on the cut holder rings. 
     
     
         18 . A manufacturing method as claimed in  claim 16 , wherein the holder substrate of the pipe shape is molded by coating a silicon carbide on a graphite molding rod of a pipe shape and the graphite molding rod is removed from the holder substrate and then, the holder substrate is cut to manufacture the holder rings.