Semiconductor device and optical pickup device

Abstract

By increasing the width of a lead terminal 2 connected to a die pad 1 in the vicinity of the die pad 1 and forming a slit 9 and a projecting plate in the lead terminal in the region where resin 5 is formed, it is possible to ensure the holding strength of the lead terminal by the resin 5 , as well as ensuring the strength of the lead terminal during the manufacturing process and achieving a reduction in thickness.

1 .- 11 . (canceled) 
     
     
         12 . A semiconductor device, in which a semiconductor element is mounted on a lead frame,
 wherein the lead frame comprises:   a die pad on which the semiconductor element is mounted;   a first lead terminal being an external terminal connected to the die pad;   one or a plurality of second lead terminals being external terminals formed separately from the die pad;   the first lead terminal being displaced from the die pad by means of a bend section and extending in a direction parallel to a surface of the die pad;   resin of a frame structure formed so as to hold the first lead terminal and the second lead terminal while forming wall faces in at least three directions in a region for mounting the semiconductor element, including a portion of the first lead terminal and the second lead terminal adjacent to the die pad;   a projecting plate formed by cutting out from the first lead terminal in which the bend section is formed in a region where the resin is formed, in a state where an edge on an opposite side to a direction of the die pad is connected; and   a slit formed by bending the projecting plate from the first lead terminal, and   wherein the projecting plate protrudes from the first lead terminal inside the resin, and the resin is also formed inside the slit.   
     
     
         13 . The semiconductor device according to  claim 12 , wherein the resin is formed so as to expose a rear surface with respect to a surface where the semiconductor element is mounted. 
     
     
         14 . The semiconductor device according to  claim 12 , wherein a lead width of the first lead terminal at least between the die pad and a neighborhood region including the bend section is greater than a lead width of the second lead terminal. 
     
     
         15 . The semiconductor device according to  claim 12 , wherein respective widths of portions of a lead constituting the first lead terminal remaining in a portion where the projecting plate is formed are 0.7 to 1.2 times a thickness of the first lead terminal. 
     
     
         16 . The semiconductor device according to  claim 12 , wherein a width of the projecting plate is 0.7 to 1.2 times a thickness of the first lead terminal. 
     
     
         17 . The semiconductor device according to  claim 12 , wherein the semiconductor element is a light emitting element. 
     
     
         18 . The semiconductor device according to  claim 12 , wherein the semiconductor element is a light receiving element. 
     
     
         19 . The semiconductor device according to  claim 12 , wherein both a light emitting element and a light receiving element are mounted as the semiconductor elements. 
     
     
         20 . (canceled)