System and method for attaching a substantially three dimensional structure to a substantially two dimensional structure

Abstract

A method and system for transporting a fluid, gas, semi-solid, cryogen, or particulate matter, or combination thereof, between a three-dimensional structure and a substantially two-dimensional structure is disclosed. A system and method for electrically coupling a three-dimensional structure to a substantially two dimensional structure is also disclosed.

1 . A method for transporting a fluid, gas, semi-solid, cryogen, particulate matter, or combinations thereof, between a three dimensional structure and a substantially two dimensional structure, comprising:
 providing a hollow member having a removable material disposed therein, said hollow member associated with a three-dimensional structure associated with an electrically conductive element, a fluidically conductive element, or a combination thereof;   associating the hollow member with a hollow transfer passage of a substantially two-dimensional structure;   covering the hollow member, and at least one of the two-dimensional structure and the three-dimensional structure with a substance;   removing the removable material to define a passage in communication with the hollow transfer passage of the substantially two-dimensional structure and the hollow member of the three-dimensional structure through the substance.   
     
     
         2 . The method of  claim 1 , further comprising:
 removing part of the hollow member to expose the removable material before applying the substance; and   associating the exposed removable material of the hollow member to the hollow transfer passage of a substantially two-dimensional structure, wherein the substance is utilized to cover the exposed removable material defines a passage between the hollow member and the hollow transfer passage.   
     
     
         3 . The method of  claim 1 , wherein the substantially three-dimensional structure is coupled to one or more dielectric substrates, with a fluid passage defined through the dielectric substrates in communication with the hollow transfer passage; and further comprising transporting a fluid, gas, semi-solid, cryogen, particulate matter, or combinations thereof, from the hollow member, through the substance, through the hollow transfer passage, to the fluid passage. 
     
     
         4 . A system for transporting a fluid, gas, semi-solid, cryogen, particulate, or combinations thereof, and for establishing a fluidic or hollow connection between two structures comprising:
 a three dimensional structure having a plurality of conductive elements associated therewith, said conductive elements each having a channel for transporting materials therealong;   a removable material disposed within the channel of the conductive elements and coupled to the substantially two-dimensional structure, the removable material being covered with a substance such that when the material is removed, a hollow transfer passage is defined,   wherein the substance mechanically connects one of the conductive passageways in the substantially two-dimensional structure to the passageways in the three-dimensional structure.   
     
     
         5 . The system of  claim 4 , wherein the two-dimensional structure can contain multiple layers for the transfer of multiple media and materials. 
     
     
         6 . The system of  claim 4 , wherein the three dimensional structure further comprises conductive elements that have a conductive member disposed therein for establishing an electrical connection with the two-dimensional structure. 
     
     
         7 . A system for electrically coupling a three dimensional structure to a substantially two-dimensional structure comprising:
 a three-dimensional conductive structure;   a substantially two-dimensional conductive structure;   means for electrically coupling the substantially two dimensional conductive structure to the three-dimensional conductive structure along an attached section while maintaining flexibility of the three-dimensional structure and promoting mechanical retention of the three dimensional structure to the two dimensional structure.   
     
     
         8 . The system of  claim 7 , wherein the three-dimensional conductive structure is tubular and the two-dimensional structure has a passageway defined therein for accepting at least part of the three-dimensional conductive structure. 
     
     
         9 . A system for electrically coupling a three dimensional structure to a substantially two-dimensional structure comprising:
 a tubular coil of conductive elements that are selectively electrically isolated from one another;   a dielectric substrate sized and shaped to come into proximity with at least a portion of the tubular coil; and   a connection pad having a connection material disposed thereon positioned on the dielectric substrate, the connection material for coupling the conductive elements to the dielectric substrate.   
     
     
         10 . The system of  claim 9 , wherein the connection pad is a conductive contact pad coupled to a surface of the dielectric substrate and the connection material is a thermally activated conductive connection material for coupling a conductive element from the tubular coil to the connection pad. 
     
     
         11 .- 26 . (canceled) 
     
     
         27 . The system of  claim 4 , wherein the three-dimensional structure contacts a plurality of two-dimensional structures. 
     
     
         28 . (canceled) 
     
     
         29 . A method for electrically coupling a three-dimensional structure to a substantially two-dimensional structure comprises:
 providing the system of  claim 7 ,   positioning the three-dimensional structure in the vicinity of the two-dimensional structure;   coupling the two dimensional structure to the three-dimensional structure for communication of the elements therebetween.   
     
     
         30 . A method for electrically coupling a three-dimensional structure to a substantially two-dimensional structure comprises:
 providing the system of  claim 9 ,   positioning the three-dimensional structure in the vicinity of the two-dimensional structure;   coupling the two dimensional structure to the three-dimensional structure for communication of the elements therebetween.   
     
     
         31 . A method for electrically coupling a three-dimensional structure to a substantially two-dimensional structure comprises:
 providing the system of claim  11 ,   positioning the three-dimensional structure in the vicinity of the two-dimensional structure;   coupling the two dimensional structure to the three-dimensional structure for communication of the elements therebetween.