US2011209858A1PendingUtilityA1

Indirect Evaporative Cooling Apparatus

Assignee: EARTHCLEAN TOHOKU CO LTDPriority: Feb 26, 2010Filed: Feb 24, 2011Published: Sep 1, 2011
Est. expiryFeb 26, 2030(~3.6 yrs left)· nominal 20-yr term from priority
Inventors:Kenichi Konno
F24F 1/0059F24F 5/0035F28D 9/0062F24F 1/0007Y02B30/54F28F 13/185F28D 21/0015F28F 21/065F28D 5/00F28D 9/0031F28F 13/003F28F 3/044F28D 9/00
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Claims

Abstract

An indirect evaporative cooling apparatus in which a substrate is disposed between a wet channel used to induce an evaporation phenomenon and a dry channel through which cooled air passes, the wet channel and the dry channel are arrayed in layers in an alternating manner, the substrate is cooled by the evaporation phenomenon occurring within the wet channel, substrates that cool the air in the dry channel by heat transfer are layered and disposed, wherein the substrate forming the wet channel and the dry channel is formed by a plastic sheet; a substrate is used in which a plurality of projections are formed as spacers on one side of the substrate of the wet channel and the dry channel, and numerous projections are formed by emboss-patterning on the surface of the substrate on which the spacers are formed and dimples are integrally formed on a back surface.

Claims

exact text as granted — not AI-modified
1 . An indirect evaporative cooling apparatus in which a substrate is disposed between a wet channel used to induce an evaporation phenomenon and a dry channel through which cooled air passes, the wet channel and the dry channel are arrayed in layers in an alternating manner, the substrate is cooled by the evaporation phenomenon occurring within the wet channel, substrates that cool the air in the dry channel by heat transfer are layered and disposed, wherein:
 the substrate forming the wet channel and the dry channel is formed by a plastic sheet; a substrate is used in which a plurality of projections are formed as spacers on one side of the substrate of the wet channel and the dry channel, and numerous projections are formed by emboss-patterning on the surface of the substrate on which the spacers are formed and dimples are integrally formed on a back surface.   
     
     
         2 . The indirect evaporative cooling apparatus according to  claim 1  in which a substrate is disposed between a wet channel used to induce an evaporation phenomenon and a dry channel through which cooled air passes, the wet channel and the dry channel are arrayed in layers in an alternating manner, the substrate is cooled by the evaporation phenomenon occurring within the wet channel, substrates that cool the air in the dry channel by heat transfer are layered and disposed, wherein:
 the substrate forming the wet channel and the dry channel is formed by a plastic sheet; a plurality of projections are formed as spacers on one side of the substrate of the wet channel and the dry channel, and numerous projections are formed by emboss-patterning on the surface of the substrate on which the spacers are formed and dimples are integrally formed on a back surface; air flow within the wet channel and air flow within the dry channel are counter-flows; and, in an exhaust opening for air that passes through each layered dry channel and is cooled, some of the air is sent into the adjacent wet channels using external static pressure, the air flow that is a counterflow to the air flow in the dry channel is created in the wet channel, and cool air is discharged, from exhaust openings provided on both sides of the substrate. 
 
     
     
         3 . The indirect evaporative cooling apparatus according to  claim 1  or  2 , wherein the plurality of spacers arrayed to form a space with a width and height of about 2 to 3 mm between adjacent substrates for air flow in each layered wet channel and dry channel are circular. 
     
     
         4 . The indirect evaporative cooling apparatus according to  claim 1  or  2 , wherein, on a wet channel surface of the substrate of the wet channel and the dry channel, a recess formed by embossing on the substrate is a dimple with a diameter of about 1.8 mm, the dimple straightens turbulent eddy of air blowing through the dry channel caused by the spacers formed in the substrate, and the heat exchange area is increased by the dimples formed on the back surface. 
     
     
         5 . The indirect evaporative cooling apparatus according to  claim 1  or  2 , wherein another exhaust opening is provided on a side opposite to the exhaust opening of the layered wet channels, and return air from outside is sent into the wet channels. 
     
     
         6 . The indirect evaporative cooling apparatus according to  claim 1  or  2 , wherein, during winter, air containing humidity discharged from the wet channel is supplied to a room and humidifies the room. 
     
     
         7 . The indirect evaporative cooling apparatus according to  claim 1  or  2 , wherein short fibers are flocked onto the wet channel side surface of the plastic sheet substrate by electrostatic flocking. 
     
     
         8 . The indirect evaporative cooling apparatus according to  claim 1  or  2  wherein the air flow passing through the wet channel and the air flow passing through the dry channel of the indirect evaporative cooling apparatus are concurrent flows. 
     
     
         9 . The indirect evaporative cooling apparatus according to  claim 1  or  2 , wherein the shape of the spacers on the substrate that is the plastic sheet is rhombic or elliptical.

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