Wiring board and method of manufacturing wiring board

Abstract

A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond at least one edge of the second substrate. At least one of the base substrate, the first substrate or the second substrate comprises pliable resin, and at least one other of the base substrate, the first substrate or the second substrate comprises an inorganic filler.

1 : A method of manufacturing a wiring board comprising:
 forming a base substrate;   forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the base substrate opposing the first surface; and   cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond an edge of the second substrate,   wherein at least one of the base substrate, the first substrate or the second substrate is formed to include pliable resin, and at least one other of the base substrate, the first substrate or the second substrate is formed to include an inorganic filler.   
     
     
         2 . The method of manufacturing a wiring board according to  claim 1 , wherein:
 the first substrate and second substrate are formed to include pliable resin, and   the base substrate is formed to include resin containing inorganic filler.   
     
     
         3 . The method according to  claim 1 , wherein:
 the base substrate is formed to include pliable resin,   the first substrate is formed to include either resin containing inorganic filler or base material of resin-impregnated inorganic fabric, and   the second substrate is formed to include either resin containing inorganic filler or base material of resin-impregnated inorganic fabric.   
     
     
         4 . The method of manufacturing a wiring board according to  claim 1 , further comprising forming a via in at least one of the first substrate or the second substrate. 
     
     
         5 . The method of manufacturing a wiring board according to  claim 1 , further comprising:
 forming an interlayer groove portion between the first substrate and the second substrate; and   filling the interlayer groove portion with at least one of a gas, liquid or solid material.   
     
     
         6 . The method of manufacturing a wiring board according to  claim 1 , further comprising forming a warping prevention portion at a step portion created when the first substrate and the second substrate are laminated with the base substrate interposed therebetween. 
     
     
         7 . The method of manufacturing a wiring board according to  claim 1 , further comprising:
 forming an opening at a step portion created when the first substrate and the second substrate are laminated with the base substrate interposed therebetween; and   filling the opening with at least one of a gas, liquid or solid material.   
     
     
         8 . The method of manufacturing a wiring board according to  claim 2 , wherein the base substrate is formed to include an inorganic filler comprising either silica filler or glass filler. 
     
     
         9 . The method of manufacturing a wiring board according to  claim 3  wherein at least one of the first and second substrates is formed to include the resin impregnated inorganic fabric and the resin impregnated inorganic fabric comprises glass cloth. 
     
     
         10 . The method of manufacturing a wiring board according to  claim 1 , further comprising:
 forming a conductive pattern on the first substrate;   forming a conductive pattern on the second substrate; and   connecting the conductive pattern on the first substrate and the conductive pattern on the second substrate by way of the through-hole.   
     
     
         11 . The method of manufacturing a wiring board according to  claim 4 , further comprising:
 forming a conductive layer on an inner surface of the via by plating; and   filling the via with metal.   
     
     
         12 . The manufacturing method of wiring board according to  claim 4 , further comprising:
 forming a conductive layer on an inner surface of the via by plating; and   filling the via with resin.   
     
     
         13 . The method of manufacturing a wiring board according to  claim 1 , wherein:
 the forming the first substrate comprises forming the first substrate with a first lower-layer insulation layer and a first upper-layer insulation layer, and the forming the second substrate comprises forming the second substrate with a second lower-layer insulation layer and a second upper-layer insulation layer.   
     
     
         14 . The method of manufacturing a wiring board according to  claim 13 , further comprising:
 forming a conductive pattern on each of the upper-layer insulation layers;   forming a conductive pattern on each of the lower-layer insulation layers; and   connecting each conductive pattern on the upper-layer insulation layers to a respective conductive pattern on the lower-layer insulation layers through vias.   
     
     
         15 . The method of manufacturing a wiring board according to  claim 1 , further comprising forming the first insulation layer on the first surface of the base substrate and a second insulating layer on a second surface of the base substrate such that opposing ends of the first substrate are not aligned with an end of the second substrate such that a central portion of the wiring board is thicker than a peripheral portion of the wiring board corresponding to the opposing ends.