Led array grid, method and device for manufacturing said grid and led component for use in the same

Abstract

Disclosed herein is a method for producing an LED array grid including the steps of (i) arranging N electrically conducting parallel wires, where N is an integer >1, thus creating an array of wires having a width D perpendicular to a direction of the wires, (ii) arranging LED components to the array of wires such that each LED component is electrically coupled to at least two adjacent wires, (iii) stretching the array of wires such that the width D increases, and arranging the stretched LED array grid onto a plate or between two plates

1 - 17 . (canceled) 
     
     
         18 . A method for production of an LED array grid, the method comprising the steps of:
 arranging N electrically conducting wires (W 1 -W N ) in parallel, where N is an integer >1, thus creating an array of wires (W 1 -W N ), said array having a width D perpendicular to a length direction of the wires (W 1 -W N ),   arranging LED components to the array of wires such that each LED component is electrically coupled to at least two adjacent wires (W n -W n+1 ),   stretching the array of wires such that the width D increases and a gap is formed between adjacent wires, and   arranging the stretched LED array grid onto a substrate.   
     
     
         19 . The method of  claim 18 , wherein the LED components are arranged such that the LED components are distributed at regular intervals after stretching of the grid. 
     
     
         20 . The method of  claim 19 , wherein the LED components are arranged such that, in a direction perpendicular to the length direction of the wires (W 1 -W N ), the stretched LED array grid comprises at least one row of LED components bridging every other gap between adjacent wires. 
     
     
         21 . The method of  claim 18 , wherein the array of wires is formed by winding a wire in a helical fashion around an assembly drum and wherein a winding of the array of wires leaves the assembly drum after the step of arranging each LED component to the two adjacent wires, thereby creating a cylinder-shaped grid of wires and LED components. 
     
     
         22 . The method of  claim 21 , further comprising the step of cutting the wire at least once along each winding of the cylinder-shaped grid. 
     
     
         23 . The method of  claim 18 , wherein the LED components are soldered to the wires. 
     
     
         24 . The method of  claim 18 , wherein the substrate comprises at least one glass plate. 
     
     
         25 . The method of  claim 18 , further comprising the steps of:
 providing a substrate comprising a leadframe material,   folding the substrate in order to obtain positions for receiving a wire,   interconnecting LED components by wire bonding or a flip-chip technique, and   over moulding the LED components with a clear.   
     
     
         26 . An illumination system comprising a LED array grid manufactured according to  claim 18 . 
     
     
         27 . The illumination system according to claim  13 , wherein the LED array grid is bonded to the glass plate. 
     
     
         28 . The illumination system according to claim  13 , wherein the LED array grid is disposed between two glass plates.