Contacting component, method of producing the same, and test tool having the contacting component

Abstract

A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact is made of a conductive material and formed on the other surface of the insulating substrate. The conductive circuit and the probe contact are electrically connected in a through hole penetrating the insulating substrate. The probe contact includes a bump contact of a convex shape, the bump contact is formed by plating and having a surface which has a shape of a semispherical protrusion to be contacted with the target portion. The bump contact is made of a material containing a metal and carbon, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive.

1 . A contacting component having a probe contact formed by plating and adapted to be contacted with a target portion,
 the probe contact being made of a material containing nickel and carbon, the probe contact including nickel or a nickel alloy as a main material, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive, the carbon being included as nickel carbide.   
     
     
         2 . A contacting component having a probe contact formed by plating and adapted to be contacted with a target portion,
 the probe contact being made of a material containing nickel and carbon, the probe contact including nickel or a nickel alloy as a main material, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive, the carbon being concentrated to a grain boundary between adjacent crystals of the nickel or the nickel alloy included in the probe contact.   
     
     
         3 . The contacting component according to  claim 1 , wherein the probe contact is made of a material having a hardness between 450 Hv and 950 Hv in Vickers hardness and a stress not greater than 30 kg/mm 2 . 
     
     
         4 . The contacting component according to  claim 1 , wherein the contacting component comprises an insulating substrate, a conductive circuit formed on a surface of the insulating substrate, and the probe contact of a conductive material formed on another surface of the insulating substrate, the conductive circuit and the probe contact being electrically connected to each other by a conductive portion of a conductive substance filled in a through hole penetrating the insulating substrate, the conductive circuit and the probe contact being integral with each other. 
     
     
         5 . The contacting component according to  claim 2 , wherein the probe contact is made of a material having a hardness between 450 Hv and 950 Hv in Vickers hardness and a stress not greater than 30 kg/mm 2 . 
     
     
         6 . The contacting component according to  claim 2 , wherein the contacting component comprises an insulating substrate, a conductive circuit formed on a surface of the insulating substrate, and the probe contact of a conductive material formed on another surface of the insulating substrate, the conductive circuit and the probe contact being electrically connected to each other by a conductive portion of a conductive substance filled in a through hole penetrating the insulating substrate, the conductive circuit and the probe contact being integral with each other.