Heat dissipation apparatus for data center

Abstract

The present invention discloses a heat dissipation apparatus that comprises a heat transfer means and an air channel. The heat transfer means is filled with a first fluid, and it has an evaporation portion and a condenser portion where the evaporation portion receives heat from at least one server and the heat is transmitted to the condenser portion through the first fluid. The air channel receives a second fluid to transfer the heat from the condenser portion into a predetermined space. The first fluid is different than the second fluid.

1 . A heat dissipation apparatus, for cooling at least one server in a data center, comprising:
 a heat transfer means, filled with a first fluid, having an evaporation portion and a condenser portion wherein said evaporation portion receives heat from said at least one server, and the heat is transmitted to said condenser portion through said first fluid; and   an air channel, receiving a second fluid to transfer the heat from said condenser portion into a predetermined space;   wherein said condenser portion further comprises a plurality of fins, and said first fluid is different than said second fluid.   
     
     
         2 . The heat dissipation apparatus according to  claim 1 , wherein said air channel encompasses said condenser portion. 
     
     
         3 . The heat dissipation apparatus according to  claim 2 , further comprising a cooling conduit and a middle conduit connected with said cooling conduit, wherein said cooling conduit receives a third fluid to convey said third fluid to said condenser portion through said middle conduit 
     
     
         4 . The heat dissipation apparatus according to  claim 3 , wherein said air channel maintains a uniform temperature distributed anywhere within said air channel. 
     
     
         5 . The heat dissipation apparatus according to  claim 4 , further comprising a fan, said fan being arranged opposite to said condenser portion and being connected to said middle conduits so as to remove the heat from said condenser portion. 
     
     
         6 . The heat dissipation apparatus according to  claim 1 , wherein said first fluid is selected from the group consisting of water, ammonia, solvent, refrigerant and coolant, or combination thereof. 
     
     
         7 . The heat dissipation apparatus according to  claim 2 , wherein said second fluid is ambient air. 
     
     
         8 . The heat dissipation apparatus according to  claim 3 , wherein said third fluid is cool air. 
     
     
         9 . The heat dissipation apparatus according to  claim 3 , wherein said heat transfer means is a flat tube provided with a plurality of micro channels therein, each of which is filled with said first fluid. 
     
     
         10 . The heat dissipation apparatus according to  claim 3 , wherein said heat transfer means is a heat pipe having a wick structure filled with said first fluid, said heat pipe being further equipped with a contact block at said evaporation portion so as to contact the heat with its contact surface of said contact block. 
     
     
         11 . A heat dissipation apparatus, for cooling at least one server in a data center, comprising:
 a heat transfer means, filled with a first fluid, having an evaporation portion and a condenser portion wherein said evaporation portion receives heat from said at least one server, and the heat is transmitted to said condenser portion through said first fluid;   wherein said condenser portion further comprises a cold plate having a loop groove therethrough, said loop groove having one opening to guide a second fluid of low temperature to flow into said cold plate and having another opening to guide said second fluid of high temperature to flow out of said cold plate.   
     
     
         12 . The heat dissipation apparatus according to  claim 11 , wherein said cold plate has on its one side a surface to contact said condenser portion of said heat transfer means. 
     
     
         13 . The heat dissipation apparatus according to  claim 11 , further comprising a first water pipe filled with said second fluid of low temperature to connect said one opening of said cold plate. 
     
     
         14 . The heat dissipation apparatus according to  claim 13 , further comprising a second water pipe to connect said another opening of said cold plate so as to drain said second fluid of high temperature out of said cold plate. 
     
     
         15 . The heat dissipation apparatus according to  claim 14 , further comprising a chiller to connect said first water pipe with said second water pipe so as to cool said second fluid for recycling. 
     
     
         16 . The heat dissipation apparatus according to  claim 15 , further comprising a pump to facilitate recycling of said second fluid. 
     
     
         17 . The heat dissipation apparatus according to  claim 11 , wherein said first fluid is selected from the group consisting of water, ammonia, solvent, refrigerant and coolant, or combination thereof. 
     
     
         18 . The heat dissipation apparatus according to  claim 13 , wherein said second fluid is water. 
     
     
         19 . The heat dissipation apparatus according to  claim 11 , wherein said heat transfer means is a flat tube provided with a plurality of micro channels therein, each of which is filled with said first fluid. 
     
     
         20 . The heat dissipation apparatus according to  claim 11 , wherein said heat transfer means is a heat pipe having a wick structure filled with said first fluid, said heat pipe being further equipped with a contact block at said evaporation portion so as to contact the heat with its contact surface of said contact block.