Temperature conditioning system method to optimize vaporization applied to cooling system

Abstract

Described herein is for a system and procedure to apply vaporization for heat transfer processes, particularly condensers in air conditioning and refrigeration systems both for upgrading units using the discontinued R22 refrigerant and for new equipments. The application can be applied to other cooling processes such as computer chip cooling, garments for medical, personal garments for military personnel. The application points to the features of different manifestations of vaporization for cooling in both natural and other equipments. The process can be extended for small and compact implementation on new equipments with maintenance improvement compared to water tower coolers, lower capitalization costs, modularity and ease of maintenance, and indoor installations enabling extension of capability of the cooling system with application of air flow condition. The advantages and implementation on new equipments for residential, industrial and large cooling units enable several advantages both economic, reliability, maintainability, indoor operation, reduction of cost of scaling problems and flexibility. Many additional applications are possible and are discussed herein, including high power computer chip cooling.

1 . A system to deliver water for vaporization and control of the convection mechanism to transport the water vapor product for cooling including:
 a. feedback control means on water delivery rate for vaporization,   b. control means of air flow for transport of vaporization product,   c. sensors to measure temperature and   d. means to control water delivery to provide water and fan speed to effect the heat transfer utilizing only vaporization and avoiding encroaching on heat transfer involving sensible heat of water.   
     
     
         2 . The system of  claim 1  further including a temperature sensor that averages the temperature on the air flow opening. 
     
     
         3 . The system of  claim 1  further including water delivery means to control the rate of drop formation. 
     
     
         4 . The system of  claim 1  further including water delivery means to deliver and form a uniform water film on a hot surface. 
     
     
         5 . The system of  claim 1  further including means to control scaling. 
     
     
         6 . The system of  claim 1  further including means for maintenance to prevent reduction in efficiency due to scaling. 
     
     
         7 . The system of  claim 6  further including means to use ultrasonic waves using scanning frequency of waveform drive together with duty cycle to enable mechanical dislodge of small bicarbonate deposit. 
     
     
         8 . The system of  claim 6  further including means for selection of materials for tray and peg for the water distribution to have a high contact angle. 
     
     
         9 . The system of  claim 8  wherein the materials are one of polycarbonate and Teflon material. 
     
     
         9 . The system of  claim 1  further including air flow velocity control to complement and/or function together with water deliver control. 
     
     
         10 . The system of  claim 1  further including means to control the air flow temperature by pre conditioning of heating and cooling to minimize air flow for transport by convection and reduce size of heat transfer structures. 
     
     
         11 . The system of  claim 9  further including means to arrange sections of a condenser to operate in either air or water vapor for transport mechanism by using sensible air flow from air convection section to precondition air flow for efficient vaporization process with other section if a compromise on full benefit of vaporization under some ambient operating conditions. 
     
     
         12 . The system of  claim 10  further including means to pre heat air for computer chip cooling. 
     
     
         13 . The system of  claim 10  further comprising means to pre condition air for computer chip cooling using Peltier heating and cooling semiconductor device. 
     
     
         14 . The system of  claim 1  further comprising means to pre condition air for large cooling loads using vaporization. 
     
     
         15 . The system of  claim 1  further comprising means to have distributed cell condenser modules on very large capacity cooling systems to minimize system downtime.