US2011186270A1PendingUtilityA1

Heat transfer device with anisotropic heat dissipating and absorption structures

Assignee: SUNA DISPLAY COPriority: Feb 1, 2010Filed: Mar 2, 2010Published: Aug 4, 2011
Est. expiryFeb 1, 2030(~3.5 yrs left)· nominal 20-yr term from priority
Inventors:Chen-Jean Chou
H10W 40/73H10W 40/77H10W 40/25F28D 15/00F28F 21/02F28D 15/04
46
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Claims

Abstract

Anisotropic thermal conducting materials are arranged in a heat dissipating device to create directional adiabatic heat transfer. In one embodiment, a preferential heat conduction is provided between a cooling substance and a dissipation layer, between a heat source and an absorption layer, and between an absorption layer and a cooling substance.

Claims

exact text as granted — not AI-modified
1 . A heat transfer device comprising:
 a heat dissipation layer having a first face and a second face on opposite sides of the layer; wherein said first face is made for contacting a cooling substance;   a means for directing a cooling substance to or away from said first face;   wherein a structure or a layer, comprising an anisotropic thermal conducting substance, is made in close contact with said first face.   
     
     
         2 . The device according to  claim 1  wherein said anisotropic thermal conducting substance is arranged to have a thermal conductivity substantially higher in the direction perpendicular to said first face than parallel. 
     
     
         3 . The device according to  claim 1  wherein said anisotropic heat conducting substance comprises a plurality of micro or nanostructures. 
     
     
         4 . The device according to  claim 1  further comprising a structure or a layer containing anisotropic thermal conducting substance placed in contact with said second face of the dissipation layer. 
     
     
         5 . The device according to  claim 4  wherein said anisotropic thermal conducting substance is arranged to have a thermal conductance preferentially higher in the direction perpendicular to said second face than parallel to the second face. 
     
     
         6 . A heat transfer device comprising
 an absorption section comprising at least an absorption layer having a first face and a second face on opposite sides of said absorption layer; wherein said first face of the absorption layer is made for contacting a heat source;   a dissipation section comprising a dissipation layer having a first face and a second face, wherein said first face of the dissipation layer is made for contacting a cooling substance;   a means for directing a cooling substance to or away from said absorption layer, and a means for directing said cooling substance to or away from said dissipation section;   wherein a structure or a layer, comprising an anisotropic thermal conducting substance, is disposed at said first face of the heat dissipation layer; wherein said anisotropic thermal conducting substance provides a thermal conductance substantially higher in one direction (longitudinal) than in a direction perpendicular to said longitudinal direction.   
     
     
         7 . The device according to  claim 6  wherein said longitudinal direction of higher thermal conductance is arranged substantially perpendicular to said first face. 
     
     
         8 . The heat transfer device according to  claim 6  wherein said anisotropic heat conducting substance comprises a plurality of micro or nanostructures. 
     
     
         9 . The device according to  claim 7  wherein said longitudinal direction of higher thermal conductance is arranged to be substantially perpendicular to said second face. 
     
     
         10 . The device according to  claim 6  further comprising a structure or a layer or a structure, containing anisotropic thermal conducting substance, placed in closed contact with said second face of the dissipation layer. 
     
     
         11 . The device according to  claim 6  wherein a structure or a layer, comprising an anisotropic thermal conducting substance, is made in direct contact with said second face. 
     
     
         12 . A heat transfer device comprising
 an absorption section comprising at least an absorption layer for contacting a heat source;   a dissipation section comprising a dissipation layer having a first face and a second face, wherein said first face of the dissipation layer is made for contacting a cooling substance;   a means for directing a cooling substance between said absorption section and dissipation section;   a layer or a structure, containing anisotropic thermal conducting substance, placed in closed contact with said second face of the dissipation layer;   wherein said anisotropic thermal conducting substance provides a thermal conductance substantially higher in one direction (the longitudinal direction) than at lest one other direction.   
     
     
         13 . The heat transfer device according to  claim 12  wherein said anisotropic heat conducting substance comprises a plurality of micro or nanostructures. 
     
     
         14 . The device according to  claim 12  wherein said longitudinal direction of higher thermal conductance is arranged to be substantially perpendicular to said second face. 
     
     
         15 . The device according to  claim 12  wherein said absorption layer comprises a first face and a second face; wherein a layer or a structure comprising an anisotropic heat conducting substance is placed on or in close contact with said second face of said absorption layer. 
     
     
         16 . The device according to  claim 12  wherein said absorption layer comprises a first face and a second face; wherein a layer or a structure comprising an anisotropic heat conducting substance is placed on or in close contact with said first face of said absorption layer. 
     
     
         17 . The device according to  claim 15  wherein said anisotropic heat conducting substance is arranged in a manner that the thermal conductance of the anisotropic thermal conducting substance is substantially higher along a direction perpendicular to said second face of said absorption layer than parallel to said second face. 
     
     
         18 . The device according to  claim 16  wherein said anisotropic heat conducting substance is arranged in a manner that the thermal conductance of the anisotropic thermal conducting substance is substantially higher along a direction perpendicular to said first face of said absorption layer than parallel to said first face.

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