US2011186266A1PendingUtilityA1

Heat transfer device with anisotropic thermal conducting structures

Assignee: SUNA DISPLAY COPriority: Feb 1, 2010Filed: Feb 4, 2010Published: Aug 4, 2011
Est. expiryFeb 1, 2030(~3.5 yrs left)· nominal 20-yr term from priority
Inventors:Chen-Jean Chou
H10W 40/73H10W 40/77H10W 40/25F28D 15/00F28F 21/02F28D 15/04
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Claims

Abstract

An isotropic thermal conducting material are arranged in a heat dissipating device to create directional adiabatic heat transfer. In one embodiment, a preferential heat conduction is provided between a heat source and an absorption layer, an absorption layer and a cooling substance, and a cooling substance and a dissipation layer. Structures are further provided to create adiabatic channeling between an absorption and a dissipation.

Claims

exact text as granted — not AI-modified
1 . A heat transfer device comprising
 an absorption section comprising an absorption layer having a first face and a second face on opposite sides of said absorption layer; wherein said first face is made for contacting a heat source;   a dissipation section for removing heat from said device;   a means for directing a cooling substance to or away from said absorption layer; and a means to move said cooling substance to or away from said dissipation section;   wherein a layer or a structure comprising an anisotropic heat conducting substance is placed on or in close contact with said second face;   wherein said anisotropic thermal conducting substance has a thermal conductance substantially higher in one direction (the longitudinal direction) than in a direction perpendicular to said longitudinal direction.   
     
     
         2 . The device according to  claim 1  wherein said structure comprising an anisotropic heat conducting substance comprises a plurality of micro or nano structures. 
     
     
         3 . The device according to  claim 1  wherein said anisotropic thermal conducting substance is arranged preferentially to have the longitudinal direction of higher thermal conductance substantially perpendicular to the surface of said second face. 
     
     
         4 . The device according to  claim 1  wherein said anisotropic heat conducting substance provides a thermal conductance substantially higher in one direction (longitudinal) than the transversal directions. 
     
     
         5 . The device according to  claim 1  wherein said anisotropic thermal conducting substance comprises one of the group of graphite, carbon nano tube, graphene, charcoal layer, charcoal sheet, similar tubular or layered structures, or sheet of carbon structures, or similar structures containing metal substitutes for carbon. 
     
     
         6 . A heat transfer device comprising:
 a heat absorption layer having a first face and a second face on opposite sides of the layer; wherein said first face is made for contacting a heat source;   a means for directing a cooling substance to or away from said second face;   wherein a structure comprising a plurality of carbon nanostructures or substantially the same structure comprising a substitute for a carbon elements is placed on or in close proximity to said second face.   
     
     
         7 . The device according to  claim 6  wherein said carbon nanostructures are formed directly on the surface of said second face in a gas-phase or liquid-phase chemical deposition. 
     
     
         8 . The heat transfer device according to  claim 6  wherein said first face comprises a structure comprising carbon-containing substance having more than 50% carbon content. 
     
     
         9 . A heat transfer device comprising:
 a heat absorption layer having a first face and a second face on opposite sides of the layer; wherein said first face is made for contacting a heat source;   a means for directing a cooling substance to or away from said second face;   wherein a layer or a structure comprising an anisotropic thermal conducting substance is placed on or in close contact to said second face.   
     
     
         10 . The heat transfer device according to  claim 9  wherein said anisotropic thermal conducting substance is formed directly onto said second face in a gas-phase or liquid-phase chemical deposition process. 
     
     
         11 . The device according to  claim 9  wherein said anisotropic thermal conducting substance comprises a plurality of micro or nano structures having substantially greater dimension in one direction (the longitudinal direction) than one of the transversal directions.

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