Apparatus and method for laminating a film on a wafer

Abstract

A method for laminating a film on a wafer includes a pre-cutting step: pre-cutting a dry film for fitting a size wafer size; a pre-attaching step: moving and pre-attaching the cut dry film on the wafer for corresponding the cut dry film and the wafer; a laminating step: laminating the cut dry film on the wafer with heating for fixing the cut dry film on the wafer. A flattening step: vertically and rigidly laminating the cut dry film on the wafer with heating again for flattening the cut dry film on the wafer.

1 . A method for laminating a film on a wafer, comprising:
 pre-cutting step: pre-cutting a dry film for fitting a wafer size;   pre-attaching step: moving and pre-attaching the cut dry film on the wafer for corresponding the cut dry film and the wafer;   laminating step: laminating the cut dry film on the wafer with heating for fixing the cut dry film on the wafer.   
     
     
         2 . The method according to  claim 1  further comprising a flattening step processed after the laminating step: vertically and rigidly laminating the cut dry film on the wafer with heating again for flattening the cut dry film on the wafer. 
     
     
         3 . (canceled) 
     
     
         4 . The method according to  claim 1 , wherein the laminating step is provided for rigidly laminating the cut dry film with heating. 
     
     
         5 . The method according to  claim 1 , wherein the laminating step is provided for softly laminating the cut dry film with heating. 
     
     
         6 . An apparatus for implementing the method of  claim 1 , further comprising:
 a cutting mechanism, the cutting mechanism having a cutting device disposed thereon for adapting to pre-cut a dry film, the cutting mechanism having a supporter disposed adjacent to the cutting device for adapting to position a wafer, the cutting mechanism having a suction member disposed thereon and corresponding to the cutting device for sucking the cut dry film to allow the cutting device pre-cutting the dry film and moving the cut dry film to the supporter; and   a laminating mechanism provided for laminating the cut dry film on the wafer, the laminating mechanism having a first lower member provided for positioning the wafer and a first upper member disposed above the first lower member for laminating the cut dry film with electrically heating for adhering the cut dry film on the wafer.   
     
     
         7 . The apparatus according to  claim 6 , wherein the cutting mechanism having a transporter provided for clamping and extending the dry film for flattening the dry film. 
     
     
         8 . The apparatus according to  claim 6  further comprising a protecting mechanism disposed in the laminating mechanism, the protecting mechanism adapted to provide a release film placed between the dry film and the upper member for adhering a material extruded from the dry film and removing the extruded material from the wafer. 
     
     
         9 . An apparatus for implementing the method of  claim 2 , further comprising:
 a cutting mechanism, the cutting mechanism having a cutting device disposed thereon for adapting to pre-cut a dry film, the cutting mechanism having a supporter disposed adjacent to the cutting device for adapting to position a wafer, the cutting mechanism having a suction member disposed and corresponding to the cutting device for sucking the cut dry film to allow the cutting device pre-cutting the dry film and moving the cut dry film to the supporter;   a laminating mechanism provided for laminating the cut dry film on the wafer, the laminating mechanism having a first lower member provided for positioning the wafer and a first upper member disposed above the first lower member for laminating the cut dry film with electrically heating to adhere the cut dry film on the wafer; and   a flattening mechanism provided for flattening the adhered dry film on the wafer, the flattening mechanism having a second lower member provided for positioning the filmed wafer and a second upper member disposed above the second lower member for laminating the adhered dry film on the wafer with electrically heating again to flattening the adhered dry film on the wafer.   
     
     
         10 . The apparatus according to  claim 9 , wherein the cutting mechanism having a transporter provided for clamping and extending the dry film for flattening the dry film. 
     
     
         11 . The apparatus according to  claim 9  further comprising a protecting mechanism disposed in the laminating mechanism, the protecting mechanism adapted to provide a release film placed between the dry film and the upper member for adhering a material extruded from the dry film and removing the extruded material from the wafer. 
     
     
         12 . The apparatus according to  claim 9  further comprising a protecting mechanism disposed in the flattening mechanism, the protecting mechanism adapted to provide a release film placed between the dry film and the upper member for adhering a material extruded from the dry film and removing the extruded material from the wafer.