Circuit Board For LED

Abstract

A submount comprising a chip mounting area, a first bonding pad and a connecting portion is provided. An LED chip is mounted on the chip mounting area. The first bonding pad is electrically connected to an electrode of the LED chip. The connecting portion has a first hollow portion and is disposed between the chip mounting area and the first bonding pad. The first hollow portion is located between the chip mounting area and the first bonding pad. The first hollow portion is located in a central region of the connecting portion.

1 . A submount comprising:
 a chip mounting area configured for an LED chip to be mounted thereon;   a first bonding pad that, when the LED chip is mounted on the chip mounting area, electrically connects to an electrode of the LED chip; and   a connecting portion having a first hollow portion and disposed between the chip mounting area and the first bonding pad, the connecting portion electrically connecting the chip mounting area and the first bonding pad with a first side of the connecting portion connected with the chip mounting area and a second side of the connecting portion connected with the first bonding pad, the first hollow portion being located between the chip mounting area and the first bonding pad, the first hollow portion being located in a central region of the connecting portion.   
     
     
         2 . The submount of  claim 1 , further comprising a second bonding pad and at least two through holes, wherein the second bonding pad is electrically connected to another electrode of the LED chip, and wherein the first bonding pad and the second bonding pad are electrically connected with an internal circuit layer of the submount via the through holes, respectively. 
     
     
         3 . The submount of  claim 2 , wherein the connecting portion further has a second hollow portion located in an edge region of the connecting portion. 
     
     
         4 . The submount of  claim 1 , wherein the connecting portion further has a second hollow portion located in a central region of the connecting portion. 
     
     
         5 . The submount of  claim 1 , wherein a surface of the chip mounting area is coated with an insulating adhesive for mounting the LED. 
     
     
         6 . The submount of  claim 1 , wherein the first hollow portion is a rectangular hollow portion. 
     
     
         7 . The submount of  claim 2 , wherein the first hollow portion is a rectangular hollow portion. 
     
     
         8 . The submount of  claim 3 , wherein the second hollow portion is a triangular hollow portion. 
     
     
         9 . The submount of  claim 4 , wherein the second hollow portion is a triangular hollow portion. 
     
     
         10 . The submount of  claim 3 , wherein the second hollow portion is a rectangular hollow portion. 
     
     
         11 . The submount of  claim 4 , wherein the second hollow portion is a rectangular hollow portion. 
     
     
         12 . A light-emitting diode (LED) package, comprising:
 an LED chip; and   a submount comprising:
 a chip mounting area on which the LED chip is mounted; 
 a first bonding pad electrically connected to an electrode of the LED chip; and 
 a connecting portion having a first hollow portion and disposed between the chip mounting area and the first bonding pad, wherein the connecting portion electrically connects the chip mounting area and the first bonding pad with one side of the connecting portion connected with the chip mounting area and another side of the connecting portion connected with the first bonding pad, wherein the first hollow portion is located between the chip mounting area and the first bonding pad, and wherein the first hollow portion is located in a central region of the connecting portion. 
   
     
     
         13 . The LED package of  claim 12 , wherein the submount further comprises a second bonding pad and at least two through holes, wherein the second bonding pad is electrically connected to another electrode of the LED chip, and wherein the first bonding pad and the second bonding pad are electrically connected with an internal circuit layer of the submount via the through holes, respectively. 
     
     
         14 . The LED package of  claim 13 , further comprising two adjacent corners in which the two through holes are correspondingly disposed. 
     
     
         15 . The LED package of  claim 13 , wherein the connecting portion further has a second hollow portion located in an edge region of the connecting portion. 
     
     
         16 . The LED package of  claim 14 , wherein the second hollow portion is a triangular hollow portion or a rectangular hollow portion. 
     
     
         17 . The LED package of  claim 12 , wherein the connecting portion further has a second hollow portion located in an edge region of the connecting portion. 
     
     
         18 . The LED package of  claim 17 , wherein the second hollow portion is a triangular hollow portion or a rectangular hollow portion. 
     
     
         19 . The LED package of  claim 12 , wherein the first hollow portion is a rectangular hollow portion. 
     
     
         20 . The LED package of  claim 13 , wherein the first hollow portion is a rectangular hollow portion.