System and Method for Manufacturing Embedded Conformal Electronics

Abstract

A method for fabricating an electronic device comprises providing a substrate, direct writing a functional material by a thermal spray on the substrate and removing a portion of the function material to form the electronic or sensory device.

1 . A method for fabricating an electronic device, comprising:
 providing a substrate;   depositing a functional material by a thermal spray on the substrate; and   removing a portion of the functional material to form the electronic or sensory device.   
     
     
         2 . The method of  claim 1 , wherein the substrate is flexible. 
     
     
         3 . The method of  claim 1 , wherein depositing is a direct writing. 
     
     
         4 . The method of  claim 1 , wherein depositing a functional material further comprises heat treating the functional material. 
     
     
         5 . The method of  claim 1 , wherein the heat treating is preformed one of before or after removing a portion of the functional material. 
     
     
         6 . The method of  claim 1 , wherein depositing further comprises forming a conformal layer on the substrate. 
     
     
         7 . The method of  claim 1 , wherein depositing the functional material further comprises providing one of a metal, a semiconductor, a ceramic, and a polymer in the thermal spray. 
     
     
         8 . The method of  claim 1 , wherein depositing the functional material further comprises providing one of a dielectric material and an insulating material. 
     
     
         9 . The method of  claim 1 , wherein removing the portion of the functional material further comprises providing a focused laser beam to the functional material. 
     
     
         10 . The method of  claim 1 , wherein the electronic device is fabricated in-situ. 
     
     
         11 . The method of  claim 1 , further comprising coating a portion of the electronic device. 
     
     
         12 . The method of  claim 1 , further comprising:
 depositing an insulating layer over the functional material after removing the portion, wherein the functional material is a bottom metal comprising at least two parallel strips, wherein a portion of each of the two parallel strips is exposed on each of at least two sides of the insulating layer;   depositing a top metal of functional material by the thermal spray over the insulating layer and exposed portions of the two parallel strips; and   removing a portion of the top metal of functional material, forming at least one strip, the at least one strip connecting a portion of one of the two parallel strips exposed on a first side of the insulating layer and a portion of a second strip of the two parallel strips exposed on a second side of the insulting layer.   
     
     
         13 . A system for fabricating an electronic device comprising:
 a thermal spray device for depositing a conformal layer of a functional material; and   a material removal device for fabricating an electronic device from the conformal layer of the functional material.   
     
     
         14 . The system of  claim 13 , further comprising a fixture for retaining a substrate upon which the conformal layer of the functional material is deposited. 
     
     
         15 . The system of  claim 13 , wherein the material removal device comprises a programmable motion device. 
     
     
         16 . The system of  claim 15 , wherein the programmable motion device comprises:
 a processor for receiving instructions; and   an articulated arm supporting the material removal device proximate to the conformal layer of the functional material, the articulated arm following the instructions received by the processor.   
     
     
         17 . The system of  claim 15 , wherein the programmable motion device comprises:
 a processor for receiving instructions; and   an articulated stage supporting the conformal layer of the functional material proximate to the material removal device, the articulated arm following the instructions received by the processor.   
     
     
         18 . The system of  claim 13 , wherein the material removal device comprises a laser. 
     
     
         19 . The system of  claim 13 , wherein the material removal device is one of a water jet, a mechanical milling machine, and an electric discharge machine. 
     
     
         20 . The method of  claim 13 , wherein the functional material is functional as deposited.