Thermal power distribution system
Abstract
The invention is comprised of one or more variably conductive thermal switches. The thermal switches are sandwiched between two thermal conductors (e.g., heat pipes). Within each thermal switch is an array of micro-switches with a number of finger-like structures that are electrically actuated to form one or more thermal connection between two thermally conductive layers. The net thermal conductance of the switch is scalable based on the number of activated micro-switches. By changing the thermal conductance between the source and the sink, the temperature of the source may be adjusted based on the needs of the system in which it is employed.
Claims
exact text as granted — not AI-modified1 . A thermal power distribution system comprising:
a first heat conducting member, a second heat conducting member, a thermally conductive switch element in thermal communication with said first heat conducting member, switch actuator means for selectively positioning said switch element to selectively define a heat flow path between said first heat conducting member and said second heat conducting member.
2 . The thermal power distribution system of claim 1 further wherein said switch actuator means comprises a piezoelectric material.
3 . The thermal power distribution system of claim 1 wherein said thermally conductive switch is comprised of copper.
4 . The thermal power distribution system of claim 1 wherein said thermally conductive switch is comprised of beryllium copper.
5 . The thermal power distribution system of claim 1 further comprising a volume defined between said first heat conducting member and said second heat conducting member.
6 . The thermal power distribution system of claim 1 wherein said volume has a partial vacuum disposed therein.
7 . The thermal power distribution system of claim 1 wherein at least one of said first or second heat conducting members comprises a heat pipe structure.
8 . The thermal power distribution system of claim 1 further comprising thermal switch control electronics.
9 . The thermal power distribution system of claim 1 further comprising heat radiating means for the discharge of heat to a predetermined location.
10 . A thermal power distribution system comprising:
a first heat conducting member, a second heat conducting member, a plurality of thermally conductive switch elements defining a switch array, wherein a plurality of thermally conductive switch elements is in thermal communication with said first heat conducting member, and, switch actuator means for selectively positioning said selected ones of said switch elements to selectively define one or more heat flow paths between said first heat conducting member and said second heat conducting member.
11 . The thermal power distribution system of claim 10 further wherein said switch actuator means comprises a piezoelectric material.
12 . The thermal power distribution system of claim 10 wherein said thermally conductive switch is comprised of copper.
13 . The thermal power distribution system of claim 10 wherein said thermally conductive switch is comprised of beryllium copper.
14 . The thermal power distribution system of claim 10 further comprising a volume defined between said first heat conducting member and said second heat conducting member.
15 . The thermal power distribution system of claim 10 wherein said volume has a partial vacuum disposed therein.
16 . The thermal power distribution system of claim 10 wherein at least one of said first or second heat conducting members comprises a heat pipe structure.
17 . The thermal power distribution system of claim 10 further comprising thermal switch control electronics.
18 . The thermal power distribution system of claim 10 further comprising heat radiating means for the discharge of heat to a predetermined location.
1 . A thermal power distribution system comprising:
a first heat conducting member, a second heat conducting member, a thermally conductive switch element, switch actuator means for selectively positioning said switch element to selectively define a heat flow path between said first heat conducting member and said second heat conducting member.Join the waitlist — get patent alerts
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