Method and system for printing aligned nanowires and other electrical devices

Abstract

Methods and systems for applying nanowires and electrical devices to surfaces are described. In a first aspect, at least one nanowire is provided proximate to an electrode pair. An electric field is generated by electrodes of the electrode pair to associate the at least one nanowire with the electrodes. The electrode pair is aligned with a region of the destination surface. The at least one nanowire is deposited from the electrode pair to the region. In another aspect, a plurality of electrical devices is provided proximate to an electrode pair. An electric field is generated by electrodes of the electrode pair to associate an electrical device of the plurality of electrical devices with the electrodes. The electrode pair is aligned with a region of the destination surface. The electrical device is deposited from the electrode pair to the region.

1 . A system for transferring nanowires to a destination surface, comprising:
 a body having a transfer surface;   an electrode pair on the transfer surface;   a suspension that includes a plurality of nanowires provided proximate to the electrode pair;   a signal generator coupled to the electrode pair, wherein the signal generator is configured to enable electrodes of the electrode pair to generate an electric field to associate at least one nanowire of the plurality of nanowires with the electrodes; and   an alignment mechanism configured to align the electrode pair with a region of the destination surface to enable the associated at least one nanowire to be deposited from the electrode pair to the region.   
     
     
         2 . A system for applying nanowires to a destination surface, comprising:
 a body having a transfer surface; and   an electrode pair formed on the transfer surface;   wherein the electrode pair is configured to generate an electric field to associate a proximate at least one nanowire with the electrode pair; and   wherein the electrode pair is configured to be aligned with a region of the destination surface to enable the associated at least one nanowire to be deposited from the electrode pair to the region.   
     
     
         3 . A method for transferring electrical devices to a destination surface, comprising:
 providing at least one electrical device proximate to an electrode pair;   generating an electric field with electrodes of the electrode pair to associate an electrical device with the electrodes;   aligning the electrode pair with a region of the destination surface; and   depositing the electrical device from the electrode pair to the region.   
     
     
         4 . The method of  claim 3 , wherein the electrical device is an integrated circuit die, wherein said depositing comprises:
 depositing the integrated circuit die from the electrode pair to the region.   
     
     
         5 . The method of  claim 3 , wherein the electrical device is one of an integrated circuit, an electrical component, or an optical device, wherein said depositing comprises:
 depositing the one of the integrated circuit, the electrical component, or the optical device from the electrode pair to the region.   
     
     
         6 . The method of  claim 3 , wherein said depositing comprises:
 ultrasonically vibrating the transfer surface to enable an attractive electrostatic force to attract the electrical device toward the destination surface.   
     
     
         7 . The method of  claim 6 , wherein said ultrasonically vibrating the transfer surface comprises:
 ultrasonically vibrating both the transfer surface and destination surface.   
     
     
         8 . The method of  claim 7 , wherein said ultrasonically vibrating the transfer surface further comprises:
 ultrasonically vibrating the transfer surface and destination surface synchronously.   
     
     
         9 . A system for transferring electrical devices to a destination surface, comprising:
 a body having a transfer surface;   an electrode pair on the transfer surface;   a suspension that includes a plurality of electrical devices provided proximate to the electrode pair;   a signal generator coupled to the electrode pair, wherein the signal generator is configured to enable electrodes of the electrode pair to generate an electric field to associate an electrical device of the plurality of electrical devices with the electrodes; and   an alignment mechanism configured to align the electrode pair with a region of the destination surface to enable the associated electrical device to be deposited from the electrode pair to the region.   
     
     
         10 . The system of  claim 9 , wherein the electrical device is an integrated circuit die. 
     
     
         11 . The system of  claim 9 , wherein the electrical device is one of an integrated circuit, an electrical component, or an optical device. 
     
     
         12 . A system for applying electrical devices to a destination surface, comprising:
 a body having a transfer surface; and   an electrode pair formed on the transfer surface;   wherein the electrode pair is configured to generate an electric field to associate a proximate electrical device with the electrode pair; and   wherein the electrode pair is configured to be aligned with a region of the destination surface to enable the associated electrical device to be deposited from the electrode pair to the region.   
     
     
         13 . The system of  claim 12 , wherein the electrical device is an integrated circuit die. 
     
     
         14 . The system of  claim 12 , wherein the electrical device is one of an integrated circuit, an electrical component, or an optical device. 
     
     
         15 . A method for transferring nanowires to a destination surface, comprising:
 positioning a transfer surface of a print head adjacent to a destination surface, wherein a nanowire is associated with the transfer surface;   reducing a distance between the transfer surface and the destination surface;   receiving a fluid in at least one opening in the transfer surface from between the transfer surface and the destination surface during said reducing; and   depositing the nanowire from the transfer surface to the destination surface.   
     
     
         16 . A system for transferring nanowires to a destination surface, comprising:
 a body having a transfer surface;   at least one opening in the transfer surface; and   an electrode pair formed on the transfer surface;   wherein the electrode pair is configured to generate an electric field to associate a nanowire with the electrode pair; and   wherein the at least one opening is configured to receive a fluid from between the transfer surface and the destination surface.   
     
     
         17 . A method for transferring nanowires to a destination substrate, comprising:
 associating nanostructures with transfer surfaces of a plurality of print heads;   performing an inspection of the transfer surfaces of the plurality of print heads;   selecting at least one print head of the plurality of print heads based on the inspection; and   transferring the nanostructures from the selected at least one print head to a plurality of regions of a surface of a destination substrate.   
     
     
         18 . A method for transferring nanowires to a destination substrate, comprising:
 associating nanostructures with transfer surfaces of a plurality of print heads;   drying the transfer surfaces having associated nanostructures;   performing an inspection of the dried transfer surfaces having associated nanostructures; and   transferring the nanostructures from the dried transfer surfaces to a plurality of regions of a surface of the destination substrate.   
     
     
         19 . A system for transferring nanowires to a destination substrate, comprising:
 an association station configured to receive a plurality of print heads, and to associate nanostructures with a transfer surface of each of the received plurality of print heads;   a printing station configured to receive a destination substrate and at least one of the plurality of print heads, and to transfer the nanostructures from the received at least one of the plurality of print heads to a plurality of regions of a surface of the destination substrate; and   a cleaning station configured to receive the plurality of print heads from the printing station, and to clean the received plurality of print heads.   
     
     
         20 . A system for applying nanowires to a destination surface, comprising:
 a body having a transfer surface;   a non-stick coating formed on the transfer surface; and   an electrode pair formed on the transfer surface;   wherein the electrode pair is configured to generate an electric field to associate a proximate at least one nanowire with the electrode pair; and   wherein the electrode pair is configured to be aligned with a region of the destination surface to enable the associated at least one nanowire to be deposited from the electrode pair to the region.   
     
     
         21 . A method for transferring nanowires to a destination substrate, comprising:
 associating nanostructures with transfer surfaces of a plurality of print heads;   performing an inspection of the transfer surfaces of the plurality of print heads;   determining an arrangement of nanostructures associated with a transfer surface of a print head of the plurality of print heads in need of repair;   repairing the determined arrangement of nanostructures; and   transferring the repaired arrangement of nanostructures from the transfer surface of the print head to a destination substrate.