Semiconductor device and manufacturing method of the same

Abstract

A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board.

1 . A semiconductor device, comprising:
 a board having a first surface, a second surface opposite to the first surface, a through-hole reaching one of the first and second surfaces from the other, and a plurality of electrodes formed on the first surface, and arranged next to the through-hole;   a heat-sink having a third surface, a protruding portion protruded from the third surface in a vertical direction, and a fourth surface opposite to the third surface, and arranged at the second surface side of the board such that the protruding portion of the heat-sink is arranged inside of the through-hole of the board, and such that the third surface of the heat-sink faces the second surface of the board;   a semiconductor chip having a front surface, a plurality of pads formed on the front surface, and a rear surface opposite to the front surface, and mounted on a protruding surface of the protruding portion of the heat-sink such that the rear surface of the semiconductor chip faces the protruding surface of the protruding portion of the heat-sink;   a plurality of wires electrically connected the pads with the electrodes, respectively; and   a sealing body sealing the first surface of the board, the semiconductor chip, and the wires.   
     
     
         2 . The semiconductor device according to  claim 1 , wherein the protruding portion of the heat-sink has a side surface located between the protruding surface and the third surface in a cross-section view; and
 wherein the side surface of the heat-sink is contacted with an inner surface of the through-hole.   
     
     
         3 . The semiconductor device according to  claim 1 , wherein the board has wiring layers, and insulating layers; and
 wherein the heat-sink is formed of a metal material.