Composition

Abstract

A composition for controlling a temperature elevation of an electronic component when soldering the electronic component on a substrate, includes a first resin for providing the composition with adhesion to the electronic component, a curing agent for curing the first resin by heat treatment for soldering, and a second resin for facilitating removal of the composition from the electronic component.

1 . A composition for controlling a temperature elevation of an electronic component when soldering the electronic component on a substrate, comprising:
 a first resin for providing the composition with adhesion to the electronic component;   a curing agent for curing the first resin by heat treatment for soldering; and   a second resin for facilitating removal of the composition from the electronic component.   
     
     
         2 . The composition according to  claim 1 , further comprising an inorganic filler made of an inorganic material having a greater specific heat than that of the first resin. 
     
     
         3 . The composition according to  claim 2 , wherein the inorganic filler is alumina, silica, chromia, titania, aluminum nitride or silicon nitride. 
     
     
         4 . The composition according to  claim 1 , wherein the second resin is a silicone resin. 
     
     
         5 . The composition according to  claim 1 , the first resin cures at a temperature in a range from 200 centigrade to 230 centigrade. 
     
     
         6 . The composition according to  claim 1 , wherein a total percent by weight of the first resin and the curing agent is within a range from 65 percent by weight to 90 percent by weight, and the percent by weight of the second resin is within a range from 35 percent by weight to 10 percent by weight when a total percent by weight of the first resin, the curing agent and the second resin is 100 percent by weight. 
     
     
         7 . The composition according to  claim 2 , wherein a percent by weight of the first resin is within a range from 5 percent by weight to 30 percent by weight, a percent by weight of the inorganic filler is 60 percent by weight, and a percent by weight of the second resin is within a range from 10 percent by weight to 35 percent by weight,
 the percent by weight of the first resin is within a range from 13 percent by weight to 18 percent by weight, a percent by weight of the inorganic filler is within a range from 70 percent by weight to 40 percent by weight, and a percent by weight of the second resin is within a range from 27 percent by weight to 42 percent by weight, or   a percent by weight of the first resin is 50 percent by weight, a percent by weight of the inorganic filler is within a range from 70 percent by weight to 50 percent by weight, and a percent by weight of the second resin is 10 percent by weight when a total percent by weight of the first resin, the inorganic filler and the second resin is 100 percent by weight.   
     
     
         8 . The composition according to  claim 1 , wherein the first resin is epoxy resin or phenol resin. 
     
     
         9 . The composition according to  claim 8 , wherein the epoxy resin is made of bisphenol-F epoxy resin and naphthalene epoxy resin. 
     
     
         10 . The composition according to  claim 1 , wherein the curing agent is microcapsulated imidazole.