US2011155363A1PendingUtilityA1
Memory module assembly and heat sink thereof
Est. expiryMay 11, 2027(~0.8 yrs left)· nominal 20-yr term from priority
Inventors:Ming-Yang Hsieh
H10W 40/226H10W 40/43
40
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Claims
Abstract
A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly cling to the respective heat source.
Claims
exact text as granted — not AI-modified1 . A heat sink assembly comprising:
a heat dissipating plate being of a one-piece construction and defining a first slit from top to bottom; and a first heat transfer medium including a base secured on the top of the heat dissipating plate and a first connecting sheet extending from an end of the base and through the first slit of the heat dissipating plate to be in contact with a side of a first heat source.
2 . The heat sink assembly of claim 1 further comprising a second heat transfer medium which includes a base secured on the top of the heat dissipating plate and a first connecting sheet extending from an end of the base, wherein the heat dissipating plate further has another first slit where the first connecting sheet of the second heat transfer medium is passed to be in contact with a side of a second heat source.
3 . The heat sink assembly of claim 1 , wherein the heat dissipating plate further defines a second slit from the top to the bottom; and the first heat transfer medium further has a second connecting sheet extending from the opposite end of the base and through the second slit of the heat dissipating plate to be in contact with the opposite side of the first heat source.
4 . The heat sink assembly of claim 3 further comprising a second heat transfer medium which includes a base secured on the top of the heat dissipating plate, a first connecting sheet, and a second connecting sheet; the first and second connecting sheets extending from opposite ends of the base respectively; and the heat dissipating plate further including another first slit and another second slit where the first and second connecting sheets of the second heat transfer medium are respectively passed to be in contact with opposite sides of a second heat source.
5 . The heat sink assembly of claim 3 , wherein the first and second connecting sheets are both resilient and each is inclined with respect to the base.
6 . The heat sink assembly of claim 1 , wherein the heat dissipating plate further defines a second slit from the top to the bottom; and the first heat transfer medium further has a second connecting sheet extending from the opposite end of the base and through the second slit of the heat dissipating plate to be in contact with a side of a second heat source.
7 . The heat sink assembly of claim 6 further comprising a second heat transfer medium which includes a base secured on the top of the heat dissipating plate, a first connecting sheet, and a second connecting sheet; the first and second connecting sheets extending from opposite ends of the base respectively; and the heat dissipating plate further including another first slit where the first connecting sheet of the second heat transfer medium is passed to be in contact with the opposite side of the second heat source, and another second slit where the second connecting sheet of the second heat transfer medium is passed to be in contact with a side of a third heat source.
8 . The heat sink assembly of claim 6 wherein the first and second connecting sheets are both resilient and each is inclined with respect to the base.
9 . The heat sink assembly of claim 1 wherein the first heat transfer medium further includes a fastening portion extending from a side of the first connecting sheet, and the fastening portion upwardly abuts against the bottom of the heat dissipating plate to affix the base onto the top of the heat dissipating plate.
10 . The heat sink assembly of claim 1 further comprising a fan, wherein the heat dissipating plate further has a through hole where the fan is mounted.
11 . A heat sink assembly comprising:
a heat dissipating plate; and a first heat transfer medium secured on a side of the heat dissipating plate and including two resilient, heat-conductive sheets which are outwardly biased such that the sheets are elastically compressed by two adjacent heat sources when placed in between the two adjacent heat sources.
12 . The heat sink assembly of claim 11 further comprising a second heat transfer medium which is secured on the heat dissipating plate and includes two resilient, heat-conductive sheets outwardly biased such that the sheets are elastically compressed by another two adjacent heat sources when placed in between the another two adjacent heat sources.
13 . The heat sink assembly of claim 11 further comprising at least one fan, wherein the heat dissipating plate further has at least one through hole where the fan is mounted.
14 . A heat sink assembly comprising:
a heat dissipating plate; and a first heat transfer medium secured on a side of the heat dissipating plate, and including two resilient, heat-conductive sheets which are inwardly biased to snugly cling to opposite sides of a first heat source.
15 . The heat sink assembly of claim 14 further comprising a second heat transfer medium which is secured on the heat dissipating plate and includes two resilient sheets inwardly biased in order to snugly cling to opposite sides of a second heat source.
16 . The heat sink assembly of claim 14 further comprising at least one fan, wherein the heat dissipating plate further has at least one through hole where the fan is mounted.Join the waitlist — get patent alerts
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