US2011155355A1PendingUtilityA1

Heat-dissipation unit coated with oxidation-resistant nano thin film and method of depositing the oxidation-resistant nano thin film thereof

Assignee: CHEN YING-TUNGPriority: Dec 29, 2009Filed: Nov 2, 2010Published: Jun 30, 2011
Est. expiryDec 29, 2029(~3.4 yrs left)· nominal 20-yr term from priority
Inventors:Ying-Tung Chen
H10W 40/73H10W 40/47H10W 40/10F28D 15/0233F28F 2245/00C23C 18/1212F28D 15/0275C23C 18/1216C23C 18/1254B82Y 30/00C23C 18/1295C23C 18/1204H05K 13/00F28D 15/04
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Claims

Abstract

A heat-dissipation unit coated with oxidation-resistant nano thin film includes a metal main body having a heat-absorbing portion and a heat-dissipating portion, both of which are coated with at least a nano metal compound thin film. To form the nano metal compound thin film on the heat-dissipation unit, first form at least a nano compound coating on an outer surface of the heat-dissipation unit, and then supply a reduction gas into a high-temperature environment to perform a heat treatment and a reduction process on the heat-dissipation unit and the nano compound coating thereof, and finally, a nano metal compound thin film is formed on the surface of the heat-dissipation unit after completion of the heat treatment and the reduction process. With the nano metal compound thin film, the heat-dissipation unit is protected against formation of oxide on its surface and accordingly against occurrence of increased thermal resistance thereof.

Claims

exact text as granted — not AI-modified
1 . A heat-dissipation unit coated with oxidation-resistant nano thin film, comprising a metal main body having a heat-absorbing portion and a heat-dissipating portion; and both of the heat-absorbing portion and the heat-dissipating portion being coated with at least a nano metal compound thin film. 
     
     
         2 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in  claim 1 , wherein the heat-dissipation unit is selected from the group consisting of a heat sink, a uniform temperature plate, a radiating fin assembly, a heat pipe, a loop heat pipe, and a water block. 
     
     
         3 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in  claim 1 , wherein the nano metal compound thin film is formed via a reaction of a reduction gas with at least a nano compound coating and the metal main body. 
     
     
         4 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in  claim 3 , wherein the nano compound coating is formed of a material selected from the group consisting of oxide, nitride, carbide, and sulfide. 
     
     
         5 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in  claim 4 , wherein the oxide is selected from the group consisting of SiO 2 , TiO 2 , Al 2 O 3 , ZrO 2 , CaO, K 2 O, and ZnO. 
     
     
         6 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in  claim 1 , wherein the metal main body is formed of a material selected from the group consisting of copper, aluminum, nickel, and stainless steel. 
     
     
         7 . A heat-dissipation unit coated with oxidation-resistant nano thin film, comprising a metal main body internally defining a chamber; the chamber being provided on an interior surface with a wick structure, and the wick structure being coated with at least a nano metal compound thin film. 
     
     
         8 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in  claim 7 , wherein the heat-dissipation unit is selected from the group consisting of a uniform temperature plate, a heat pipe, a flat heat pipe, a loop heat pipe, and a water block. 
     
     
         9 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in  claim 8 , wherein the nano metal compound thin film is formed via a reaction of a reduction gas with at least a nano compound coating and the wick structure. 
     
     
         10 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in  claim 9 , wherein the nano compound coating is formed of a material selected from the group consisting of nitride, carbide, sulfide, and oxide. 
     
     
         11 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in  claim 10 , wherein the oxide is selected from the group consisting of SiO 2 , TiO 2 , Al 2 O 3 , ZrO 2 , CaO, K 2 O, and ZnO. 
     
     
         12 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in  claim 7 , wherein the metal main body is formed of a material selected from the group consisting of copper, aluminum, nickel, and stainless steel. 
     
     
         13 . A method of depositing oxidation-resistant nano thin film on heat-dissipation unit, comprising the following steps:
 providing a heat-dissipation unit;   forming at least a nano compound coating on a surface of the heat-dissipation unit;   supplying a reduction gas into a high-temperature environment to perform a heat treatment and a reduction process on the heat-dissipation unit and the nano compound coating on the surface of the heat-dissipation unit; and   forming a nano metal compound thin film on the heat-dissipation unit after completion of the heat treatment and the reduction process.   
     
     
         14 . The method of depositing oxidation-resistant nano thin film on heat-dissipation unit as claimed in  claim 13 , wherein the heat-dissipation unit is selected from the group consisting of a heat sink, a radiating fin assembly, a heat pipe, a flat heat pipe, a loop heat pipe, and a water block. 
     
     
         15 . The method of depositing oxidation-resistant nano thin film on heat-dissipation unit as claimed in  claim 13 , wherein the reduction gas is selected from the group consisting of H 2 S, H 2 , CO, and NH 3 . 
     
     
         16 . The method of depositing oxidation-resistant nano thin film on heat-dissipation unit as claimed in  claim 13 , wherein the reduction process is performed at a temperature ranged between 600° C. and 1000° C. 
     
     
         17 . The method of depositing oxidation-resistant nano thin film on heat-dissipation unit as claimed in  claim 13 , wherein the reduction process is performed at a temperature ranged between 650° C. and 850° C. 
     
     
         18 . The method of depositing oxidation-resistant nano thin film on heat-dissipation unit as claimed in  claim 13 , wherein the nano compound coating is formed on the surface of the heat-dissipation unit through a process selected from the group consisting of physical vapor deposition (PVD), chemical vapor deposition (CVD), and sol-gel process. 
     
     
         19 . The method of depositing oxidation-resistant nano thin film on heat-dissipation unit as claimed in  claim 18 , wherein the sol-gel process is implemented in a manner selected from the group consisting of dip-coating deposition, settle-coating deposition, spin-coating deposition, brush-coating deposition, and wet-coating deposition.

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