Heat-dissipation unit coated with oxidation-resistant nano thin film and method of depositing the oxidation-resistant nano thin film thereof
Abstract
A heat-dissipation unit coated with oxidation-resistant nano thin film includes a metal main body having a heat-absorbing portion and a heat-dissipating portion, both of which are coated with at least a nano metal compound thin film. To form the nano metal compound thin film on the heat-dissipation unit, first form at least a nano compound coating on an outer surface of the heat-dissipation unit, and then supply a reduction gas into a high-temperature environment to perform a heat treatment and a reduction process on the heat-dissipation unit and the nano compound coating thereof, and finally, a nano metal compound thin film is formed on the surface of the heat-dissipation unit after completion of the heat treatment and the reduction process. With the nano metal compound thin film, the heat-dissipation unit is protected against formation of oxide on its surface and accordingly against occurrence of increased thermal resistance thereof.
Claims
exact text as granted — not AI-modified1 . A heat-dissipation unit coated with oxidation-resistant nano thin film, comprising a metal main body having a heat-absorbing portion and a heat-dissipating portion; and both of the heat-absorbing portion and the heat-dissipating portion being coated with at least a nano metal compound thin film.
2 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in claim 1 , wherein the heat-dissipation unit is selected from the group consisting of a heat sink, a uniform temperature plate, a radiating fin assembly, a heat pipe, a loop heat pipe, and a water block.
3 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in claim 1 , wherein the nano metal compound thin film is formed via a reaction of a reduction gas with at least a nano compound coating and the metal main body.
4 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in claim 3 , wherein the nano compound coating is formed of a material selected from the group consisting of oxide, nitride, carbide, and sulfide.
5 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in claim 4 , wherein the oxide is selected from the group consisting of SiO 2 , TiO 2 , Al 2 O 3 , ZrO 2 , CaO, K 2 O, and ZnO.
6 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in claim 1 , wherein the metal main body is formed of a material selected from the group consisting of copper, aluminum, nickel, and stainless steel.
7 . A heat-dissipation unit coated with oxidation-resistant nano thin film, comprising a metal main body internally defining a chamber; the chamber being provided on an interior surface with a wick structure, and the wick structure being coated with at least a nano metal compound thin film.
8 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in claim 7 , wherein the heat-dissipation unit is selected from the group consisting of a uniform temperature plate, a heat pipe, a flat heat pipe, a loop heat pipe, and a water block.
9 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in claim 8 , wherein the nano metal compound thin film is formed via a reaction of a reduction gas with at least a nano compound coating and the wick structure.
10 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in claim 9 , wherein the nano compound coating is formed of a material selected from the group consisting of nitride, carbide, sulfide, and oxide.
11 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in claim 10 , wherein the oxide is selected from the group consisting of SiO 2 , TiO 2 , Al 2 O 3 , ZrO 2 , CaO, K 2 O, and ZnO.
12 . The heat-dissipation unit coated with oxidation-resistant nano thin film as claimed in claim 7 , wherein the metal main body is formed of a material selected from the group consisting of copper, aluminum, nickel, and stainless steel.
13 . A method of depositing oxidation-resistant nano thin film on heat-dissipation unit, comprising the following steps:
providing a heat-dissipation unit; forming at least a nano compound coating on a surface of the heat-dissipation unit; supplying a reduction gas into a high-temperature environment to perform a heat treatment and a reduction process on the heat-dissipation unit and the nano compound coating on the surface of the heat-dissipation unit; and forming a nano metal compound thin film on the heat-dissipation unit after completion of the heat treatment and the reduction process.
14 . The method of depositing oxidation-resistant nano thin film on heat-dissipation unit as claimed in claim 13 , wherein the heat-dissipation unit is selected from the group consisting of a heat sink, a radiating fin assembly, a heat pipe, a flat heat pipe, a loop heat pipe, and a water block.
15 . The method of depositing oxidation-resistant nano thin film on heat-dissipation unit as claimed in claim 13 , wherein the reduction gas is selected from the group consisting of H 2 S, H 2 , CO, and NH 3 .
16 . The method of depositing oxidation-resistant nano thin film on heat-dissipation unit as claimed in claim 13 , wherein the reduction process is performed at a temperature ranged between 600° C. and 1000° C.
17 . The method of depositing oxidation-resistant nano thin film on heat-dissipation unit as claimed in claim 13 , wherein the reduction process is performed at a temperature ranged between 650° C. and 850° C.
18 . The method of depositing oxidation-resistant nano thin film on heat-dissipation unit as claimed in claim 13 , wherein the nano compound coating is formed on the surface of the heat-dissipation unit through a process selected from the group consisting of physical vapor deposition (PVD), chemical vapor deposition (CVD), and sol-gel process.
19 . The method of depositing oxidation-resistant nano thin film on heat-dissipation unit as claimed in claim 18 , wherein the sol-gel process is implemented in a manner selected from the group consisting of dip-coating deposition, settle-coating deposition, spin-coating deposition, brush-coating deposition, and wet-coating deposition.Join the waitlist — get patent alerts
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