Miniaturized liquid cooling device

Abstract

An exemplary miniaturized liquid cooling device includes a base, a closed loop pipe and electrode units formed on the base. The loop pipe has a pipe body defining a loop passage therein for accommodating a working fluid. A hydrophobic layer is formed on an inner surface of the pipe body. The electrode units are spaced from each other along the loop pipe. Each electrode unit comprises a first electrode and an opposite second electrode. The first and the second electrodes of each electrode unit are located at two sides of the pipe body of the loop pipe to sandwich the pipe body therebetween. A first dielectric layer is formed between the first electrode and an outer surface of the pipe body. A second dielectric layer is formed between the second electrode and the outer surface of the pipe body.

1 . A miniaturized liquid cooling device, comprising:
 a base;   a closed loop pipe formed on the base, the loop pipe comprising a pipe body defining a loop passage therein, a hydrophobic layer being formed on an inner surface of the pipe body;   a working fluid accommodated in the loop passage of the loop pipe; and   a plurality of electrode units formed on the base and spaced from each other along the loop pipe, each electrode unit comprising a first electrode and an opposite second electrode, the first electrode and the second electrode of each electrode unit being located at two sides of the pipe body of the loop pipe to sandwich the pipe body of the loop pipe therebetween, a first dielectric layer being formed between the first electrode and an outer surface of the pipe body of the loop pipe, and a second dielectric layer being formed between the second electrode and the outer surface of the pipe body of the loop pipe.   
     
     
         2 . The miniaturized liquid cooling device of  claim 1 , further comprising a control circuit, the first electrode and the second electrode of each electrode unit being electrically connected to the control circuit, voltages being regularly applied on the electrode units via the control circuit so as to drive the working fluid to move along the loop passage of the loop pipe during operation of the liquid cooling device. 
     
     
         3 . The miniaturized liquid cooling device of  claim 2 , wherein the loop pipe further comprises at least one reservoir fluidly communicating with the pipe body. 
     
     
         4 . The miniaturized liquid cooling device of  claim 3 , wherein the at least one reservoir is generally spherical. 
     
     
         5 . The miniaturized liquid cooling device of  claim 1 , wherein the base defines a loop groove in a top surface thereof, and the loop pipe is located in the loop groove. 
     
     
         6 . The miniaturized liquid cooling device of  claim 1 , wherein the loop pipe is integrally formed on the base. 
     
     
         7 . The miniaturized liquid cooling device of  claim 6 , wherein the loop pipe comprises a heat absorbing section, the base at the heat absorbing section being configured for being thermally connected to an electronic component. 
     
     
         8 . The miniaturized liquid cooling device of  claim 7 , wherein the loop of the loop pipe has a substantially rectangular frame shape, and the loop pipe further comprises a heat dissipation section located opposite to the heat absorbing section. 
     
     
         9 . The miniaturized liquid cooling device of  claim 1 , wherein the first electrode and the second electrode of each electrode unit are integrally formed on the base. 
     
     
         10 . The miniaturized liquid cooling device of  claim 1 , wherein the base is made of one of glass and silicon. 
     
     
         11 . The miniaturized liquid cooling device of  claim 1 , wherein the electrode units are arranged along substantially an entire length of the loop pipe. 
     
     
         12 . The miniaturized liquid cooling device of  claim 11 , wherein the electrode units are arranged at substantially regular intervals along the entire length of the loop pipe. 
     
     
         13 . A miniaturized liquid cooling device for cooling an object, the miniaturized liquid cooling device comprising:
 a base;   a closed loop pipe formed on the base, the loop pipe comprising a pipe body defining a loop passage therein, and a hydrophobic layer formed on an inner surface of the pipe body, the loop pipe having a heat absorbing section and an opposite heat dissipation section, the base at the heat absorbing section configured for being thermally connected to the object;   a working fluid accommodated in the loop passage of the loop pipe;   a plurality of electrode units formed on the base and spaced from each other along a length of the loop pipe, each electrode unit comprising a first electrode and an opposite second electrode, the first electrode and the second electrode of each electrode unit being located at two sides of the pipe body of the loop pipe to sandwich the pipe body of the loop pipe therebetween;   a first dielectric layer formed between the first electrode and an outer surface of the pipe body of the loop pipe; and   a second dielectric layer formed between the second electrode and the outer surface of the pipe body of the loop pipe.   
     
     
         14 . The miniaturized liquid cooling device of  claim 13 , further comprising a control circuit, the first electrode and the second electrode of each electrode unit being electrically connected to the control circuit, voltages being regularly applied on the electrode units via the control circuit so as to drive the working fluid to move along the loop passage of the loop pipe during operation of the liquid cooling device. 
     
     
         15 . The miniaturized liquid cooling device of  claim 13 , wherein the base defines a loop groove in an outer surface thereof, and the loop pipe is located in the loop groove. 
     
     
         16 . The miniaturized liquid cooling device of  claim 15 , wherein the loop pipe is integrally formed on the base. 
     
     
         17 . The miniaturized liquid cooling device of  claim 13 , wherein the base is one of following materials: glass and silicon. 
     
     
         18 . The miniaturized liquid cooling device of  claim 17 , wherein the first electrode and the second electrode of each electrode unit are integrally formed on the base. 
     
     
         19 . The miniaturized liquid cooling device of  claim 1 , wherein the electrode units are arranged along substantially an entire length of the loop pipe. 
     
     
         20 . The miniaturized liquid cooling device of  claim 19 , wherein the electrode units are arranged at substantially regular intervals along the entire length of the loop pipe.