US2011143483A1PendingUtilityA1

Transparent conductive layer and method of manufacturing the same

Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Jul 4, 2008Filed: Feb 24, 2011Published: Jun 16, 2011
Est. expiryJul 4, 2028(~1.9 yrs left)· nominal 20-yr term from priority
H10F 77/707H10F 77/251H10F 71/138H10F 71/00H10F 77/20H10F 77/244H10F 10/00Y02E10/50Y02E10/548
58
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A transparent conductive layer includes a substrate, a first conductive layer disposed on the substrate, and a second conductive layer disposed on the first conductive layer, wherein the second conductive layer comprises a textured surface and an opening which exposes the first conductive layer, wherein the opening comprises a diameter of about 1 micrometer to about 3 micrometers. Also disclosed is a method of manufacturing the transparent conductive layer and a photoelectric device.

Claims

exact text as granted — not AI-modified
1 . A method of manufacturing a transparent conductive layer, the method comprising:
 disposing a first conductive layer and a second conductive layer on a substrate, wherein the first conductive layer and the second conductive layer are disposed sequentially;   etching the second conductive layer to form a textured surface on the second conductive layer; and   etching the second conductive layer to form an opening which exposes a top surface of the first conductive layer.   
     
     
         2 . The method of  claim 1 , wherein the first conductive layer is formed with In 2 O 3 , and the second conductive layer is formed with a ZnO-based material. 
     
     
         3 . The method of  claim 2 , wherein the etching of the second conductive layer further comprises using an etching solution, which has an etching selection ratio of equal to or greater than about 10:1 of the second conductive layer to the first conductive layer. 
     
     
         4 . The method of  claim 3 , wherein the etching solution comprises at least one acid selected from the group consisting of nitric acid, hydrochloric acid, sulfuric acid, acetic acid, and a combination comprising at least one of the foregoing acids. 
     
     
         5 . The method of  claim 1 , wherein the opening which exposes the top surface of the first conductive layer comprises a diameter between about 1 micrometer to about 3 micrometers.

Join the waitlist — get patent alerts

Track US2011143483A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.