Heater unit, heating and cooling device, and apparatus comprising same

Abstract

A heater unit has excellent uniform heat properties in a wafer placement surface, and is capable of rapid temperature increase and rapid cooling, also has high rigidity. A heating and cooling device that includes the heater unit is used as a manufacturing or inspection apparatus and is used for work with glass substrates or semiconductor substrates for flat panel displays. The heater comprises a first uniform heat plate having a placement surface on which a substrate is placed, a second uniform heat plate for supporting the first uniform heat plate, and at least one layer of a insulated resistance heating element provided between the first uniform heat plate and the second uniform heat plate. The first uniform heat plate and the second uniform heat plate have a differing thermal conductivity and differing Young's modulus.

1 . A heater unit comprising:
 a first uniform heat plate having a placement surface for placing a substrate;   a second uniform heat plate for supporting the first uniform heat plate; and   at least one layer of an insulated resistance heating element provided between the first uniform heat plate and the second uniform heat plate;   the first uniform heat plate of the heater unit having a first thermal conductivity K 1  and a first Young's modulus Y 1 , and the second uniform heat plate of the heater unit have a second thermal conductivity K 2  and a second Young's modulus Y 2 , where K 1 ≠K 2  and Y 1 ≠Y 2 .   
     
     
         2 . The heater unit according to  claim 1 , wherein
 the first uniform heat plate is formed of a metal, the second uniform heat plate is formed of a ceramic or a metal-ceramic composite material, the relationship between the thermal conductivity of each of the first uniform heat plate and the second uniform heat plate is K 1 >K 2 , and the relationship between the Young's modulus of each of the first uniform heat plate and the second uniform heat plate is Y 2 >Y 1 .   
     
     
         3 . The heater unit according to  claim 2 , wherein
 the total of the thicknesses of the first uniform heat plate and the second uniform heat plate is 1/40 or less of the diameter of the first uniform heat plate, the insulated resistance heating element is integrally formed using a resistance heating element and a heat-resistant insulator, the heat-resistant insulator is a heat-resistant insulator whose primary constituent is polyimide or Teflon, or both, and the thickness of the insulated resistance heating element is 0.5 mm or less.   
     
     
         4 . The heater unit according to  claim 2 , wherein
 the first uniform heat plate and the second uniform heat plate are each 1 mm or greater in thickness.   
     
     
         5 . The heater unit according to  claim 2 , wherein
 the second uniform heat plate has a surface in contact with the insulated resistance heating element and the surface has a flatness that is 100 μm or less.   
     
     
         6 . The heater unit according to  claim 2 , wherein
 the second uniform heat plate has a surface in contact with the insulated resistance heating element, the surface includes an upwardly concave shape.   
     
     
         7 . The heater unit according to  claim 1 , wherein
 the first uniform heat plate and the second uniform heat plate are bonded together so that their opposing surfaces are movable relative to each other in substantially parallel directions, and one of the first uniform heat plate and the second uniform heat plate is formed of metal and is subjected to processing providing flexibility on at least one side, while the other of the first uniform heat plate and the second uniform heat plate is formed of a ceramic or a metal-ceramic composite material.   
     
     
         8 . The heater unit according to  claim 7 , wherein
 the one of the first uniform heat plate and the second uniform heat plate comprises a metal with a first thickness and the other of the first uniform heat plate and the second uniform heat plate comprises a ceramic or a metal-ceramic composite material with a second thickness, the first thickness being equal to or less than the second thickness.   
     
     
         9 . The heater unit according to  claim 7 , wherein
 the second uniform heat plate includes a surface in contact with the insulated resistance heating element, the surface having a flatness that is 100 μm or less.   
     
     
         10 . The heater unit according to  claim 7 , wherein
 the second uniform heat plate includes a surface in contact with the insulated resistance heating element, the surface having an upwardly concave shape.   
     
     
         11 . The heater unit according to  claim 7 , wherein
 the first uniform heat plate and the second uniform heat plate are bonded together by vacuum-suction means.   
     
     
         12 . The heater unit according to  claim 11 , further comprising
 a vacuum-sealing device used as the vacuum-suction means.   
     
     
         13 . The heater unit according to  claim 12 , wherein
 the vacuum-sealing device is disposed adjacent to an external peripheral section of the first uniform heat plate and the second uniform heat plate.   
     
     
         14 . The heater unit according to  claim 7 , wherein
 the first uniform heat plate and the second uniform heat plate are bonded together by a combination of screws and bearings.   
     
     
         15 . A heating and cooling device comprising the heater unit according to  claim 1 , and a mobile cooling plate disposed underneath the heater unit. 
     
     
         16 . A manufacturing apparatus for glass substrates or semiconductor substrates for flat panel displays, comprising the heater unit according to  claim 1 . 
     
     
         17 . An inspection apparatus for glass substrates or semiconductor substrates for flat panel displays, comprising the heater unit according to  claim 1 . 
     
     
         18 . A manufacturing apparatus for glass substrates or semiconductor substrates for flat panel displays, comprising the heating and cooling device according to  claim 15 . 
     
     
         19 . An inspection apparatus for glass substrates or semiconductor substrates for flat panel displays, comprising the heating and cooling device according to  claim 15 .