Drill and method of producing printed wiring board
Abstract
A printed wiring board manufacturing method for forming a hole penetrating through a board having an electric conductor layer and forming the electric conductor layer in the hole to make electrical connection, the method including forming a hole that penetrates through the board in accordance with a drill featured in that a blade portion is formed at a distal end and a groove is formed by one stripe, and an occupying rate of a metal at a proximal end of the blade tip of the body is in the range of 40% to 80%; and a curvature radius in an axially vertical direction of a deepest portion of the groove is in the range of 1.50 to 3.50 mm, forming an electric conductor layer in a hole, and forming an electric conductor circuit on a top layer of the board.
Claims
exact text as granted — not AI-modified1 . A printed wiring board manufacturing method for forming a hole penetrating through a board having an electric conductor layer and forming the electric conductor layer in the hole to make electrical connection, the method comprising:
forming a hole that penetrates through the board in accordance with a drill featured in that a blade portion is formed at a distal end and a groove is formed by one stripe, and an occupying rate of a metal at a proximal end of the blade tip of the body is in the range of 40% to 80%; and a curvature radius in an axially vertical direction of a deepest portion of the groove is in the range of 1.50 to 3.50 mm; forming an electric conductor layer in a hole; and forming an electric conductor circuit on a top layer of the board.
2 . The printed wiring board manufacturing method according to claim 1 ,
wherein the step of carrying out desmear processing is carried out after the hole forming step.
3 . The printed wiring board manufacturing method according to claim 1 ,
wherein a distal end diameter of a drill in the hole forming step is equal to or smaller than 300 microns.
4 . The printed wiring board manufacturing method according to claim 1 ,
wherein a torsion angle of the drill is in the range of 30 degrees to 50 degrees.
5 . A printed wiring board manufacturing method for forming a hole penetrating through a board having an electric conductor layer and forming the electric conductor layer in the hole to make electrical connection, the method comprising:
forming an opening that penetrates a board by means of a drill featured in that a shaving discharge groove is formed in a one-stripe shape at a body and a torsion angle of the shaving discharge groove is in the range of 30 degrees to 50 degrees. forming an electric conductor layer in a hole; and forming an electric conductor circuit in a top layer of the substrate.
6 . The printed wiring board manufacturing method as claimed in claim 5 ,
wherein, in the drill, an occupying rate of a metal at the proximal end of the blade tip of the body is in the range of 40% to 80%, and a curvature radius in an axially vertical direction of a deepest portion of a groove at the proximal end is in the range of 1.50 mm to 3.50 mm.
7 . The printed wiring board manufacturing method according to claim 2 ,
wherein a distal end diameter of a drill in the hole forming step is equal to or smaller than 300 microns.Join the waitlist — get patent alerts
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