US2011138616A1PendingUtilityA1
Printed circuit board manufacturing system
Est. expiryJul 25, 2027(~1 yrs left)· nominal 20-yr term from priority
H05K 3/0008H05K 2201/09918H05K 3/0035H05K 1/0269H05K 3/4679H05K 2201/0108H05K 3/4644Y10T29/49124H05K 3/42
47
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Claims
Abstract
A printed circuit board manufacturing system that uses a substrate that includes a pad and an insulation layer covering the pad. The system includes an image sensor part acquiring an image of the substrate, a control part generating a control signal to form a via hole, and a laser applying part applying a laser, considering the control signal, to the part of the insulation layer that corresponds to the location information of the pad.
Claims
exact text as granted — not AI-modified1 . A printed circuit board manufacturing system, using a substrate that comprises a pad and an insulation layer covering the pad, comprising:
an image sensor part to acquire an image of the substrate; a control part to generate a control signal to form a via hole; and a laser applying part to apply a laser, considering the control signal, to a part of the insulation layer that corresponds to location information of the pad.
2 . The printed circuit board manufacturing system of claim 1 , wherein the control part extracts a center coordinate of an area that corresponds to the pad in the image of the substrate.Join the waitlist — get patent alerts
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