Image sensor module for camera device

Abstract

An image sensor module includes a circuit board, an image sensor, and a supporting board. The image sensor is electrically connected to the circuit board. The circuit board defines a through opening therein. The supporting board is arranged on one side of the circuit board and includes a protrusion. The protrusion extends outwardly from the supporting board and includes a square-shaped block no larger than the image sensor. The square-shaped block passes through the through opening. The image sensor is mounted on the block and spaced from the circuit board.

1 . An image sensor module comprising:
 a circuit board defining a through opening therein;   an image sensor electrically connected to the circuit board; and   a supporting board arranged on one side of the circuit board and comprising a protrusion extending outwardly from the supporting board, the protrusion comprising a square-shaped block having a size no larger than that of the image sensor, the block passing through the through opening of the circuit board, the image sensor being mounted on the block and spaced from the circuit board.   
     
     
         2 . The image sensor module of  claim 1 , wherein the block has a planar top mounting surface, the image sensor is positioned on the planar top mounting surface. 
     
     
         3 . The image sensor module of  claim 1 , wherein an adhesive layer is applied between the image sensor and the block, the adhesive layer being one of thermosetting adhesive, UV adhesive and black adhesive. 
     
     
         4 . The image sensor module of  claim 1 , wherein the protrusion extends from a central portion of the supporting surface, a concave is defined in a bottom side of the supporting board corresponding to the protrusion. 
     
     
         5 . The image sensor module of  claim 1 , wherein the through opening is the same size or larger than the block, and smaller than the image sensor. 
     
     
         6 . An image sensor module comprising:
 a supporting board comprising a supporting surface and a protrusion, the protrusion extending upwardly from the supporting surface, the protrusion comprising at least one square-shaped block;   a circuit board arranged on the supporting surface of the supporting board, the circuit board defining at least one through opening for extension of the at least one square-shaped block therethrough, a thickness of the circuit board being smaller than that of the at least one square-shaped block; and   an image sensor arranged on the at least one square-shaped block, the image sensor being spaced from the circuit board and being electrically connected to the circuit board, the image sensor covering the at least one square-shaped block.