Pb-FREE COPPER ALLOY SLIDING MATERIAL AND PLAIN BEARINGS
Abstract
[Task] In the provided Cu-based sliding material, the properties equivalent to those of a Pb-containing material is attained even free of Pb, and material has stable friction coefficient. [Solution Means] A Pb-free copper-alloy sliding material contains 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, and 0.5 to 30.0% of Zn is contained. Further, if necessary, 1.0 to 10.0 mass % of at least one of a group consisting of Fe 3 P, Fe 2 P, FeB, NiB and AlN, having an average particle diameter of 1.5 to 70 μm is contained.
Claims
exact text as granted — not AI-modified1 . A Pb-free copper-alloy sliding material which contains, by mass percentage, 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, with the balance being Cu and unavoidable impurities, and is characterized in that said Ag and Bi from an Ag—Bi eutectic.
2 . A Pb-free copper-alloy sliding material according to claim 1 , characterized in that the material further contains, by mass percentage, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, and 0.5 to 30.0% of Zn.
3 . A Pb-free copper-alloy sliding material according to claim 1 or 2 , characterized in that the material contains, by mass percentage, 1.0 to 10.0% of at least one of a group consisting of Fe 3 P, Fe 2 P, FeB, NiB and AlN, having an average particle diameter of 1.5 to 70 μm.
4 . A Pb-free copper-alloy sliding material according to claim 1 , characterized in that neither Ag nor Bi is essentially dissolved in the Cu matrix, and is not precipitated in a morphology except for said Ag—Bi eutectic.
5 . A plain bearing, wherein a Pb-free copper-alloy sliding material according to claim 1 , is bonded to a backing metal by sintering.Join the waitlist — get patent alerts
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